公开(公告)号：EP0513831B1

公开(公告)日：1998-10-14

申请号：EP92108285.5

申请日：1992-05-15

Applicant: HITACHI TELECOM TECHNOLOGIES, LTD. ,  SANWA LABORATORY LTD.

Inventor： Gunji, Hiroshi ,  Yamaguchi, Kenichi ,  Tachibana, Daikichi

IPC: B23K35/363 ,  C23F11/14

CPC classification number: B23K35/3615 ,  C23F11/149 ,  H05K3/282 ,  H05K3/3489 ,  H05K2203/0591 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

公开(公告)号：EP0562187B1

公开(公告)日：1996-01-10

申请号：EP92302521.7

申请日：1992-03-24

Applicant: SANWA LABORATORY LTD.

Inventor： Yamaguchi, Hideaki ,  Kawai, Hideyuki ,  Tachibana, Daikichi ,  Yamaguchi, Kenichi

IPC: H05K3/06

CPC classification number: H05K3/061 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

公开(公告)号：EP0562187A1

公开(公告)日：1993-09-29

申请号：EP92302521.7

申请日：1992-03-24

Applicant: SANWA LABORATORY LTD.

Inventor： Yamaguchi, Hideaki ,  Kawai, Hideyuki ,  Tachibana, Daikichi ,  Yamaguchi, Kenichi

IPC: H05K3/06 ,  C23F1/02

CPC classification number: H05K3/061 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

Abstract: Copper through-hole printed wiring boards are produced by forming an etching resist layer on the copper plating of a double sided copper clad laminate. The etching resist layer is formed after a negative resist pattern is applied to both sides of the laminate, and then dipped in a solution containing at least one salt of 2-alkylbenzimidazoles, 2-alkylalkyl-benzimidazoles, 2-phenyl-benzimidazoles and 2-phenyl-alkylbenzimidazoles. After the negative resist pattern is selectively removed with an alkaline aqueous solution, in accordane with the predetermined pattern of the wiring, the exposed copper plating is etched off with an alkali etchant.

Abstract translation: 通过在双面覆铜层压板的镀铜上形成抗蚀剂层来制造铜通孔印刷线路板。 在将抗蚀剂图案施加到层叠体的两面之后形成抗蚀剂层，然后浸入含有2-烷基苯并咪唑，2-烷基烷基 - 苯并咪唑，2-苯基 - 苯并咪唑和2-苯基 - 苯并咪唑的至少一种盐的溶液中， 苯基alkylbenzimidazoles。 在用碱性水溶液选择性除去负的抗蚀剂图案之后，根据布线的预定图案，用碱蚀刻剂蚀刻暴露的镀铜层。

公开(公告)号：EP0513831A1

公开(公告)日：1992-11-19

申请号：EP92108285.5

申请日：1992-05-15

Applicant: HITACHI TELECOM TECHNOLOGIES, LTD. ,  SANWA LABORATORY LTD.

Inventor： Gunji, Hiroshi ,  Yamaguchi, Kenichi ,  Tachibana, Daikichi

IPC: B23K35/363 ,  C23F11/14

CPC classification number: B23K35/3615 ,  C23F11/149 ,  H05K3/282 ,  H05K3/3489 ,  H05K2203/0591 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: The method comprises applying to the surface of a metal a preflux containing as an active component a benzimidazole compound represented by the following general formula (1):

(wherein R₁ stands for H or an alkyl group of three to 17 carbon atoms, R₂ for H or an alkyl group of one to six carbon atoms, and n for an integer in the range between 0 and 3) or the following general formula (2):

(wherein R₃ for H or an alkyl group of one to six carbon atoms, R₄ for H or an alkyl group of one to six carbon atoms, R₅ for an alkyl group of zero to seven carbon atoms, and n for an integer in the range between 0 and 3) and then performing an oxidizing treatment thereon.
A printed wiring board according to this invention has a film of benzimidazole copper complex formed by this method on the metallic surface for mounting of electronic parts.

Abstract translation: （ worin R1代表H或烷基3至17个碳原子的的：所述方法包括向金属表面上的预焊剂包含以活性成分由下述通式表示的苯并咪唑化合物（1） R2为H或烷基一至六个碳原子组成，和n为在0和之间的范围内的整数3）或下述通式（2）：（worin R3为H或烷基之一的 至六个碳原子，R 4为H或烷基一至六个碳原子的的，R5为在烷基的0至7个碳原子，n为在0之间的范围内的整数和3），然后在氧化处理执行 在其上。 一种印刷线路板，雅丁本发明具有通过在金属表面上该方法对于电子部件安装FORMED苯并咪唑的铜络合物的膜。