公开(公告)号：EP2688374A4

公开(公告)日：2015-09-02

申请号：EP12866400

申请日：2012-05-30

Applicant: SANYO ELECTRIC CO

Inventor： SAITO TAKAO ,  OHSHIMA MAKOTO

IPC: H05K1/18 ,  H01R4/02 ,  H01R4/38 ,  H01R12/51 ,  H01R12/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01R12/515 ,  H01R12/58 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10333

Abstract: [Problem] To provide a printed circuit board in which it is possible to decrease generation of heat in a terminal block mounted on the printed circuit board. [Solution] A printed circuit board (10) comprising: a printed wiring (11); a terminal block (13) configured by folding a solderable plate member having a foot (31); a soldered part (14) for connecting the printed wiring (11) and the terminal block (13) arranged on the printed wiring; and a through-hole (12) provided to the soldered part (14), for insertion of the foot (31); the foot (31) being inserted into the through-hole (12) and connected by soldering; the printed circuit board comprising a solderable metal wire (17) arranged on the soldered part (14) along the terminal block (13); the soldered part (14), the terminal block (13), and the metal wire (17) being integrally soldered during soldering by solder fed through the through-hole (12).