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1.
公开(公告)号:WO2019125051A1
公开(公告)日:2019-06-27
申请号:PCT/KR2018/016474
申请日:2018-12-21
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: CHAE, Jong Hyeon , LEE, Ho Joon , JANG, Seong Gyu
IPC: H01L25/075 , H01L27/15
Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed under the first LED sub-unit, each of the electrode pads being electrically connected to at least one of the first, second, and third LED sub-units, and lead electrodes electrically connected to the electrode pads and extending outwardly from the first LED sub-unit.
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2.
公开(公告)号:WO2019135606A1
公开(公告)日:2019-07-11
申请号:PCT/KR2019/000062
申请日:2019-01-03
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: JANG, Seong Gyu , LEE, Ho Joon , CHAE, Jong Hyeon , LEE, Chung Hoon
IPC: H01L27/15
Abstract: A light emitting diode pixel for a display includes a first subpixel, a second subpixel, and a third subpixel, each of the first, second, and third subpixels including a first LED sub-unit including a first type of semiconductor layer and a second type of semiconductor layer, a second LED sub-unit disposed on the first LED sub-unit and including a first type of semiconductor layer and a second type of semiconductor layer, and a third LED sub-unit disposed on the second LED sub-unit and including a first type of semiconductor layer and a second type of semiconductor layer, in which the second and third LED sub-units of the first subpixel are electrically floated, the first and third LED sub-units of the second subpixel are electrically floated, and the first and second LED sub-units of the third subpixel are electrically floated.
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3.
公开(公告)号:WO2019112304A1
公开(公告)日:2019-06-13
申请号:PCT/KR2018/015268
申请日:2018-12-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: KIM, Chang Yeon , CHAE, Jong Hyeon , JANG, Jong Min , LEE, Ho Joon , JANG, Seong Gyu
Abstract: A light emitting device for a display includes a substrate and first, second, and third LED sub-units, a first transparent electrode between the first and second LED sub-units and in ohmic contact with the first LED sub-unit, a second transparent electrode between the second and third LED sub-units and in ohmic contact with the second LED sub-unit, a third transparent electrode between the second transparent electrode and the third LED sub-unit and in ohmic contact with the third LED sub-unit, at least one current spreader connected to at least one of the first, second, and third LED sub-units, electrode pads disposed on the substrate, and through-hole vias formed through the substrate, in which at least one of the through-hole vias is formed through the substrate and the first and second LED sub-units.
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公开(公告)号:WO2019103568A1
公开(公告)日:2019-05-31
申请号:PCT/KR2018/014674
申请日:2018-11-27
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: CHAE, Jong Hyeon , JANG, Seong Gyu , LEE, Ho Joon , KIM, Chang Yeon , LEE, Chung Hoon
IPC: H01L25/075 , H01L27/12 , H01L33/40 , H01L33/42 , G09G3/00
Abstract: A light emitting device including first, second, and third LED sub-units, and electrode pads disposed on the first LED sub-unit, electrically connected to the LED sub-units, and including a common electrode pad electrically connected to each of the LED sub-units, and first, second, and third electrode pads connected to a respective one of the LED sub-units, in which the common electrode pad, the second electrode pad, and the third electrode pad are electrically connected to the second LED sub-unit and the third LED sub-unit through holes that pass through the first LED sub-unit, the first, second, and third LED sub-units are configured to be independently driven, light generated in the first LED sub-unit emitted to the outside through the second and third LED sub-units, and light generated in the second LED sub-unit is emitted to the outside through the third LED sub-unit.
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公开(公告)号:WO2019103566A1
公开(公告)日:2019-05-31
申请号:PCT/KR2018/014671
申请日:2018-11-27
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: KIM, Chang Yeon , CHAE, Jong Hyeon , LEE, Chung Hoon , JANG, Seong Gyu , JANG, Jong Min , LEE, Ho Joon
IPC: H01L25/065 , H01L33/42 , H01L33/56 , H01L33/00 , H01L33/62
Abstract: A light emitting chip includes a light emitting structure including a first light emitting sub-unit, a second light emitting sub-unit, and a third light emitting sub-unit vertically stacked on each other, and a first passivation layer covering at least part of the light emitting structure, in which the first passivation layer has a bottom surface that exposes the light emitting structure to permit light from the first, second, and third sub-units to be emitted from the light emitting chip.
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公开(公告)号:WO2019125055A1
公开(公告)日:2019-06-27
申请号:PCT/KR2018/016482
申请日:2018-12-21
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: LEE, Chung Hoon , CHAE, Jong Hyeon , JANG, Seong Gyu , LEE, Ho Joon
Abstract: A light emitting stacked structure including a plurality of epitaxial sub-units disposed one over another, each of the epitaxial sub-units configured to emit different colored light, in which each epitaxial sub-unit has a light emitting area that overlaps one another, and at least one epitaxial sub-unit has an area different from the area of another epitaxial sub-unit.
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公开(公告)号:WO2019117656A1
公开(公告)日:2019-06-20
申请号:PCT/KR2018/015888
申请日:2018-12-14
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: CHAE, Jong Hyeon , JANG, Seong Gyu , LEE, Ho Joon
Abstract: A light emitting stacked structure including a plurality of epitaxial sub-units disposed one over another, each epitaxial sub-unit configured to emit colored light having different wavelength band from each other, and a common electrode disposed between and connected to adjacent epitaxial sub-units, in which light emitting regions of the epitaxial sub-units overlap each other.
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公开(公告)号:EP3913668A1
公开(公告)日:2021-11-24
申请号:EP21182972.6
申请日:2018-11-27
Applicant: Seoul Viosys Co., Ltd
Inventor: CHAE, Jong Hyeon , LEE, Chung Hoon , JANG, Seong Gyu , KIM, Chang Yeon , LEE, Ho Joon
IPC: H01L25/075 , H01L33/38 , H01L33/40 , H01L33/00
Abstract: A light emitting diode (LED) stack for a display includes a first LED sub-unit having a first surface and a second surface, a second LED sub-unit disposed on the first surface of the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a reflective electrode disposed on the second side of the second LED sub-unit and forming ohmic contact with the first LED sub-unit, and an ohmic electrode interposed between the first LED sub-unit and the second LED sub-unit and forming ohmic contact with the first LED sub-unit, in which the second LED sub-unit and the third LED sub-unit are configured to transmit light generated from the first LED sub-unit, and the third LED sub-unit is configured to transmit light generated from the second LED sub-unit.
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公开(公告)号:EP3729518A1
公开(公告)日:2020-10-28
申请号:EP18890359.5
申请日:2018-12-21
Applicant: Seoul Viosys Co., Ltd
Inventor: LEE, Chung Hoon , CHAE, Jong Hyeon , JANG, Seong Gyu , LEE, Ho Joon
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公开(公告)号:EP4407697A2
公开(公告)日:2024-07-31
申请号:EP24169073.4
申请日:2020-02-06
Applicant: Seoul Viosys Co., Ltd.
Inventor: LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
IPC: H01L33/00
CPC classification number: H01L33/42 , H01L33/62 , H01L25/0756 , H01L33/382
Abstract: A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
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