1.
    发明专利
    未知

    公开(公告)号:DE69826349D1

    公开(公告)日:2004-10-28

    申请号:DE69826349

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

    4.
    发明专利
    未知

    公开(公告)号:DE69840837D1

    公开(公告)日:2009-06-25

    申请号:DE69840837

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

    5.
    发明专利
    未知

    公开(公告)号:DE69832308D1

    公开(公告)日:2005-12-15

    申请号:DE69832308

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

    6.
    发明专利
    未知

    公开(公告)号:DE69826349T2

    公开(公告)日:2005-09-29

    申请号:DE69826349

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

    9.
    发明专利
    未知

    公开(公告)号:DE69837796T2

    公开(公告)日:2008-03-06

    申请号:DE69837796

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

    10.
    发明专利
    未知

    公开(公告)号:DE69837796D1

    公开(公告)日:2007-06-28

    申请号:DE69837796

    申请日:1998-03-04

    Applicant: SHARP KK

    Abstract: The device has a substrate with a line pattern, and a circuit unit (1) with a number of electrode pads (4). Each pad comprising major sides and minor sides is coupled to a bonding pad (6). Each of the electrode pads is aligned in a direction parallel to the minor sides of the electrode pads. A number of bump electrodes (5a, 5b) is aligned on each of the electrode pads in a direction parallel to the major sides.

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