-
公开(公告)号：JP2004009696A
公开(公告)日：2004-01-15
申请号：JP2002170156
申请日：2002-06-11
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI , NAKAJIMA YOSHINORI , SAGARA SATOYUKI
IPC: B41J2/16
Abstract: PROBLEM TO BE SOLVED: To detect the positions of parts assembled on a nozzle head with a higher accuracy. SOLUTION: The nozzle head 100 comprises a base plate 102, on the surface of which a plurality of ink grooves 108 for discharging ink are formed, vibration plates 104 mounted on the surface, where the ink grooves 108 are formed, as opposed to each other and a nozzle plate 106 having discharge holes 112 with the number thereof corresponding to the plurality of ink grooves 108. The base plate 102 has evaluation grooves 110 so formed on the surface thereof as to make the width of each thereof equal to that of each of the ink grooves 108. The nozzle plate 106 is installed at a position that satisfies a predetermined relationship with the evaluation grooves 110 while making the plurality of ink grooves 108 face the discharge holes 112 respectively. COPYRIGHT: (C)2004,JPO
-
公开(公告)号：JP2002361875A
公开(公告)日：2002-12-18
申请号：JP2001177488
申请日：2001-06-12
Applicant: SHARP KK
Inventor： SAKAMOTO YASUHIRO , YOSHIOKA TOMOYOSHI
IPC: B41J2/16
Abstract: PROBLEM TO BE SOLVED: To surely prevent breaking of a pressing device, deterioration of smoothness of an opposing face to the pressing device, and peeling of a nozzle plate from a front face of an inkjet head body. SOLUTION: A rear face of the nozzle plate 10 is pressed against the front face of the inkjet head body 20 coated by an epoxy adhesive 3 with the pressing device therebetween 1, the pressing device having the area smaller than the front face of the nozzle plate 10. Even when the excessive epoxy adhesive 3 leaks to a peripheral portion of the nozzle plate 10 and rises along the side face of the nozzle plate 10, the epoxy adhesive 3 is not adhered to the pressing device 1. When the pressing device 1 is separated from the nozzle plate 10, the epoxy adhesive is not peeled therefrom and the pressing device 1 is not damaged. It is possible to prevent the peeling of the peripheral portion of the nozzle plate 10 from the front face of the inkjet head body 20 which may occur when the peripheral portion is raised with the epoxy adhesive 3 adhered to the rising pressing device 1. It is possible to eliminate the lowering of the attracting property of the nozzle plate 10 which may occur when the smoothness of the opposing face of the pressing device 1 is deteriorated by the adhesion of the epoxy adhesive 3.
-
3.发明专利
公开(公告)号：JP2002008905A
公开(公告)日：2002-01-11
申请号：JP2000182107
申请日：2000-06-16
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI , DEGUCHI HARUHIKO , KOMODA TOMOHISA
Abstract: PROBLEM TO BE SOLVED: To provide a temperature-sensing resistive material which is formed on a film that has a high Yong's modulus, low oxygen permeability, and low moisture absorption characteristics, capable of dispensing with a thermal treatment process after it has been formed into a film, formed into a thin film at a low temperature through a sputtering method small in resistivity, and has a temperature coefficient of resistance -4%/ deg.C or lower or its large absolute value at a room temperature, and to provide a method of manufacturing the same. SOLUTION: A temperature-sensing resistive material is formed into a film, on a silicon nitride film in an atmosphere of mixed gas of argon, oxygen, and unavoidable impurities through a sputtering treatment. In Figure 1, the temperature characteristics of the resistivity of vanadium oxide as a temperature-sensing resistive material in a temperature-rise process is shown on a semilogarithmic graph, with abscissas denoting temperature ( deg.C), and the ordinate denotes resistivity ρ (Ω.cm) (log scale).
-
公开(公告)号：JP2001174336A
公开(公告)日：2001-06-29
申请号：JP36156799
申请日：1999-12-20
Applicant: SHARP KK
Inventor： DEGUCHI HARUHIKO , YOSHIOKA TOMOYOSHI , KOMODA TOMOHISA
Abstract: PROBLEM TO BE SOLVED: To provide a temperature sensitive material film and its manufacturing method capable of improving the sensor sensitivity without being affected by temperature changes in the operating environment of a sensor. SOLUTION: In a process for manufacturing a titanium oxide film formed by spattering in the mixed gas atmosphere of argon and oxygen with titanium used as a target, the oxygen partial pressure in the mixed gas atmosphere is set to 1.7×10-3 Pa or above to manufacture the titanium oxide film with the oxygen concentration of 66 at.% or above in the film. A bolometer type far infrared sensor using this titanium oxide film as the temperature sensitive material film is not affected by the temperature changes in the operating environment of the sensor, and the sensitivity of the sensor can be sharply improved as compared with a bolometer type far infrared sensor using vanadium dioxide as the temperature sensitive material film.
-
公开(公告)号：JPH0589205A
公开(公告)日：1993-04-09
申请号：JP25151891
申请日：1991-09-30
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI
Abstract: PURPOSE:To provide an automatic wiring method capable of easily performing the wiring of plural nets required to consider electrical characteristic. CONSTITUTION:The net considering the electrical characteristic is retrieved from all the nets(step S1), and line width in which a correction value is attached on the net required to consider the electrical characteristic out of retrieved nets is set(step S2), and the wiring of the inter-line spacing values of the wiring of all nets is performed based on a spacing rule between ordinary signal lines(step S3), and a spacing correction value is eliminated from the line width on which the correction value of the net required to consider the electrical characteristic is attached(step S4).
-
Patent Agency Ranking
公开(公告)号：JPH03101151A
公开(公告)日：1991-04-25
申请号：JP23744789
申请日：1989-09-13
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI
IPC: H01L21/822 , H01L21/82 , H01L27/04
Abstract: PURPOSE:To prevent the width of an interconnection region from being expanded and to reduce the chip area to a minimum by a method wherein the uneven degree of the outer shape of the interconnection region between adjacent macrocells is evaluated and a region whose degree is smaller is decided as an interconnection channel. CONSTITUTION:It is assumed that blocks as shown in (A) are given and that a floor plan graph is formed. It is first judged whether a straight channel can be generated or not. In this case, channels 14 and 15 become coordinates and can be generated; they are decided according to two coordinates (which includes critical paths in the horizontal direction and the vertical direction as short as possible and whose uneven degree of the shape at a crossing part is smaller). Then, edges of the graph corresponding to the decided channel are removed and the graph is renewed. When a straight channel is decided, an L-shaped channel is decided under similar conditions regarding the arrangement of the residual block by selecting a smaller uneven degree of the shape at a bent part.
-
公开(公告)号：JP2002307692A
公开(公告)日：2002-10-23
申请号：JP2001113806
申请日：2001-04-12
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI , KAKIWAKI NARIMITSU
Abstract: PROBLEM TO BE SOLVED: To solidly maintain an adhesion state of a cover plate and a nozzle plate to an upper face and a front face of a substrate without complicating a manufacturing process, and surely protect an electrode film formed inside an ink chamber from ink. SOLUTION: A plurality of grooves 2 are formed to the upper face of the substrate 1, and electrodes 4 are formed to upper parts of inner side faces of partition walls 3 in each groove 2. The cover plate 5 is bonded via an adhesive to the upper face of the substrate 1. Thereafter, parylene films 6 are formed to two side faces, an upper face and a bottom face inside the ink chamber constituted of the groove 2. The parylene film 6 is surely formed also to a corner formed by an upper end of the electrode 4 and an inner side face of the cover plate 5 in the ink chamber 2, and therefore the electrode 4 is prevented from contacting the ink even partially and being eroded by the ink. Moreover, the ink is prevented from invading a joint between an upper face of the partition wall 3 and the upper end of the electrode 4 at the cover plate 5, so that the adhesive used for jointing the cover plate 5 is prevented from being eroded by the ink.
-
公开(公告)号：JP2002307687A
公开(公告)日：2002-10-23
申请号：JP2001109894
申请日：2001-04-09
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI , KOSHIRO YOSHIAKI , KAKIWAKI NARIMITSU
IPC: B41J2/16
Abstract: PROBLEM TO BE SOLVED: To provide an ink discharge device in which the trouble of clogging an ink discharge hole by an adhesive is prevented by improving the bond strength and the adhesion strength of a nozzle plate and restricting an adhesion amount to enter an ink channel. SOLUTION: The ink discharge device is constituted by bonding and uniting the nozzle plate having ink discharge holes 4 with a head having a plurality of ink channels parallel to each other correspondingly to the ink discharge holes 4 in a communication state for applying a jet energy to ink. In the ink discharge device, a hollow groove 5 is formed to an adhesion face of the nozzle plate 1 or the head part in a manner to surround the ink channels.
-
公开(公告)号：JP2002071450A
公开(公告)日：2002-03-08
申请号：JP2000259744
申请日：2000-08-29
Applicant: SHARP KK
Inventor： DEGUCHI HARUHIKO , YOSHIOKA TOMOYOSHI , KOMODA TOMOHISA
Abstract: PROBLEM TO BE SOLVED: To provide a thermal infrared detecting element and the manufacturing method and an infrared image pick-up device using the thermal infrared detecting element which can prevent deterioration of the reliability of the without adding the manufacturing process. SOLUTION: The detecting element is provided with supporting legs 4.4 which support a diaphragm 3 that has a high refractive index film 42 and a second oxidated silicone film 32 on a diaphragm structure in a state where the diaphragm is separated from the semi-conductor board 2. The diaphragm 3 and the legs 4.4 have a first oxidated silicone film 31 in the lower rayer. The expansion power 8 which makes the diaphragm 3 and the legs 4.4 convex downward is added to the first oxidated silicone film 31. The expansion power 9 which hold the diaphragm 3 skelton almost parallel to the semi-conductor board 2 cancelling the expansion power 8 that makes the diaphragm 3 convex downward is added to the high refractive index film 42 of the diaphragm 3 itself.
-
公开(公告)号：JP2000046905A
公开(公告)日：2000-02-18
申请号：JP21446898
申请日：1998-07-29
Applicant: SHARP KK
Inventor： YOSHIOKA TOMOYOSHI
Abstract: PROBLEM TO BE SOLVED: To obtain a reliability evaluating method for an electronic equipment, and a device thereof that can easily and accurately determine a life cycle number and can evaluate reliability more easily and accurately. SOLUTION: In a step a1, a temperature cycle test to a specified electronic equipment is done and an universal relation formula between a life cycle number and a distortion amplitude, namely a life-distortion relation formula, to every electronic equipment is determined. In a next step a2, a thermal stress simulation to an analysis model for any electronic equipment and a distortion amplitude is calculated. Then, the distortion amplitude to the analysis model for any electronic equipment is substituted into the life-distortion relation, and a life cycle number of the analysis model of any electronic equipment is determined. As a result, the life cycle number of the equipment can be easily and accurately determined and reliability of the electronic equipment can be easily and accurately evaluated.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.022 seconds)
