公开(公告)号：US12234318B2

公开(公告)日：2025-02-25

申请号：US17787424

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Yong Chen ,  Yongjing Xu ,  Guofang Tang

IPC: B32B15/092 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/40 ,  C08G59/42 ,  C08J5/24 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K5/5313 ,  C08K5/5377 ,  C08K5/5419 ,  B32B5/02 ,  B32B5/26

Abstract: Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.