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    METHOD OF FORMING PATTERN ON SUBSTRATE
    2.
    发明申请
    METHOD OF FORMING PATTERN ON SUBSTRATE 审中-公开
    在基板上形成图案的方法

    公开(公告)号：WO2010097039A1

    公开(公告)日：2010-09-02

    申请号：PCT/CN2010/070731

    申请日：2010-02-24

    Applicant: BYD COMPANY LIMITED ,  GAO, Chunnan ,  LU, Ping ,  CUI, Xiaolu ,  LI, Aihua

    Inventor： GAO, Chunnan ,  LU, Ping ,  CUI, Xiaolu ,  LI, Aihua

    IPC: G03F7/20

    CPC classification number: G03C1/73

    Abstract: The present invention discloses a method of forming a pattern on a substrate, which comprises the following steps: (1) coating a surface of the substrate with at least one kind of dye stuff which is capable of changing color while irradiated by ultraviolet (UV) light whereas unchanged while irradiated by visible light; and (2) irradiating at least a portion of the surface coated with the layer of the dye stuff by the UV light to obtain the desired pattern.

    Abstract translation: 本发明公开了一种在基板上形成图案的方法，其包括以下步骤：（1）用至少一种能够在紫外线（UV）照射下改变颜色的染料，涂覆基材的表面， 光而不变，同时可见光照射; 和（2）通过UV光照射涂覆有染料的层的表面的至少一部分以获得所需的图案。

    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME
    3.
    发明申请
    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME 审中-公开
    复合材料及其制备方法

    公开(公告)号：WO2010078836A1

    公开(公告)日：2010-07-15

    申请号：PCT/CN2010/070010

    申请日：2010-01-04

    Applicant: BYD COMPANY LIMITED ,  GAO, Chunnan ,  LU, Ping ,  LI, Aihua ,  CHEN, Liang

    Inventor： GAO, Chunnan ,  LU, Ping ,  LI, Aihua ,  CHEN, Liang

    IPC: C25D11/18 ,  B05D5/06

    CPC classification number: C25D11/243 ,  Y10T428/249953

    Abstract: The present invention discloses a composite material comprising: a substrate with an anodic oxide film layer having micropores; and at least one kind of dye filled in the micropores, wherein amount of the same kind of dye is gradient distribution on at least part of the substrate. The composite material has an even, metal gloss, uneasily scratched and wore out surface with gradually changed color. Moreover, the present invention also provided a method of preparing the same.

    Abstract translation: 本发明公开了一种复合材料，其包括：具有具有微孔的阳极氧化膜层的基板; 和填充在微孔中的至少一种染料，其中相同种类的染料的量是至少部分基底上的梯度分布。 复合材料具有均匀的金属光泽，不均匀地划伤并且表面逐渐变色。 此外，本发明还提供了制备该方法的方法。

    ELECTROPLATING METHOD AND ELECTROPLATED PRODUCT
    4.
    发明申请
    ELECTROPLATING METHOD AND ELECTROPLATED PRODUCT 审中-公开
    电镀方法和电镀产品

    公开(公告)号：WO2010072121A1

    公开(公告)日：2010-07-01

    申请号：PCT/CN2009/075555

    申请日：2009-12-14

    Applicant: BYD COMPANY LIMITED ,  SUN, Jipeng ,  LI, Aihua ,  LI, Zaichun ,  PENG, Bo

    Inventor： SUN, Jipeng ,  LI, Aihua ,  LI, Zaichun ,  PENG, Bo

    IPC: C25D5/10 ,  C25D5/44 ,  C25D5/30

    CPC classification number: C23C28/023 ,  C23C28/021 ,  C23C28/025 ,  C25D3/06 ,  C25D3/38 ,  C25D3/58 ,  C25D5/12 ,  Y10T428/12736

    Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu-Sn alloy layer onto the second copper layer from a Cu-Sn electroplating solution; and electroplating a chromium layer onto the Cu-Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.

    Abstract translation: 一种用于电镀具有铝合金表面的基板的方法包括：在铝合金表面上施加锌层; 从碱性铜电镀溶液中将第一铜层电镀到锌层上; 从酸性铜电镀溶液中将第二铜层电镀在第一铜层上; 从Cu-Sn电镀液中将Cu-Sn合金层电镀在第二铜层上; 并从三价铬溶液中将铬层电镀到Cu-Sn合金层上。 碱性铜电镀溶液基本上不含氰化物离子。

    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME
    5.
    发明公开
    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME 审中-公开
    复合材料及其制造方法

    公开(公告)号：EP2373834A1

    公开(公告)日：2011-10-12

    申请号：EP10729095.9

    申请日：2010-01-04

    Applicant: BYD Company Limited

    Inventor： GAO, Chunnan ,  LU, Ping ,  LI, Aihua ,  CHEN, Liang

    IPC: C25D11/18 ,  B05D5/06

    CPC classification number: C25D11/243 ,  Y10T428/249953

    Abstract: The present invention discloses a composite material comprising: a substrate with an anodic oxide film layer having micropores; and at least one kind of dye filled in the micropores, wherein amount of the same kind of dye is gradient distribution on at least part of the substrate. The composite material has an even, metal gloss, uneasily scratched and wore out surface with gradually changed color. Moreover, the present invention also provided a method of preparing the same.

    ELECTRONIC PRODUCT METAL HOUSING FORMED WITH ANTENNA GROOVE AND MANUFACTURING METHOD THEREFOR
    8.
    发明公开
    ELECTRONIC PRODUCT METAL HOUSING FORMED WITH ANTENNA GROOVE AND MANUFACTURING METHOD THEREFOR 审中-公开
    由天线槽形成的电子产品金属外壳及其制造方法

    公开(公告)号：EP3240377A1

    公开(公告)日：2017-11-01

    申请号：EP15871766.0

    申请日：2015-10-23

    Applicant: BYD Company Limited

    Inventor： JIANG, Baorong ,  LIAO, Chongchong ,  LI, Aihua ,  CHEN, Liang

    IPC: H05K5/04

    CPC classification number: H05K5/04 ,  C23F1/28 ,  C25D11/022 ,  H01Q1/243 ,  H04M1/0202 ,  H04M1/026 ,  H04M1/0283 ,  H05K3/067

    Abstract: The present disclosure provides an electronic product metal shell with an antenna groove and a method of manufacturing the same. The electronic product metal shell includes a metal layer and a hard anodic oxidation layer; the hard anodic oxidation layer is coated on surface of the metal layer; a step is formed on a first surface of the electronic product metal shell; the step penetrates through the hard anodic oxidation layer coated on a first surface of the metal layer and part of the metal layer in a thickness direction of the electronic product metal shell; the antenna groove is disposed within the step and penetrates through residual part of the metal layer in the thickness direction so as to expose an inner side of the hard anodic oxidation layer coated on a second surface of the metal layer; and a non-conductive material is filled in the antenna groove.

    Abstract translation: 本发明提供一种具有天线槽的电子产品金属外壳及其制造方法。 电子产品金属壳体包括金属层和硬质阳极氧化层， 硬质阳极氧化层被涂覆在金属层的表面上; 所述电子产品金属壳的第一表面形成台阶， 该台阶穿过金属层的第一表面和电子产品金属壳体的厚度方向上的部分金属层上所覆盖的硬质阳极氧化层; 所述天线槽设置在所述台阶内，并沿所述厚度方向穿过所述金属层的剩余部分，以暴露涂覆在所述金属层的第二表面上的所述硬质阳极氧化层的内侧; 并在天线槽中填充非导电材料。

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