公开(公告)号：WO2014094619A1

公开(公告)日：2014-06-26

申请号：PCT/CN2013/089823

申请日：2013-12-18

Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

Inventor： LI, Minggang

IPC: H01L33/00 ,  H01L33/36 ,  H01L33/50

CPC classification number: H01L33/005 ,  H01L33/0079 ,  H01L33/505 ,  H01L2933/0016

Abstract: A method for manufacturing a white LED chip, comprises: providing a substrate (100); forming a buffer layer (200) on the substrate; forming a semiconductor light-emitting structure on the buffer layer; forming a current diffusion layer (400) on the semiconductor light-emitting structure; forming a phosphor layer (500) on the current diffusion layer (400); forming a first electrode (601) in the phosphor layer (500); providing an introduced substrate (700); bonding the introduced substrate (700) with the phosphor layer (500) and the first electrode (601) under a first preset temperature and in an electric field; forming a second electrode (602) in the substrate (100); and removing the introduced substrate (700).

Abstract translation: 一种白色LED芯片的制造方法，包括：提供基板（100）; 在衬底上形成缓冲层（200）; 在缓冲层上形成半导体发光结构; 在半导体发光结构上形成电流扩散层（400）; 在所述电流扩散层（400）上形成荧光体层（500）; 在所述荧光体层（500）中形成第一电极（601）; 提供引入的衬底（700）; 在第一预设温度和电场下将引入的基板（700）与荧光体层（500）和第一电极（601）接合; 在所述基板（100）中形成第二电极（602）; 以及去除引入的基板（700）。