COMPOSITE HONEYCOMB SANDWICH BOARD AND METHOD FOR PREPARING THE SAME
    2.
    发明申请
    COMPOSITE HONEYCOMB SANDWICH BOARD AND METHOD FOR PREPARING THE SAME 审中-公开
    复合蜂窝夹层板及其制备方法

    公开(公告)号:WO2017114416A1

    公开(公告)日:2017-07-06

    申请号:PCT/CN2016/112651

    申请日:2016-12-28

    CPC classification number: B32B3/12

    Abstract: Provided is a composite honeycomb sandwich board and a method for preparing the same. The composite honeycomb sandwich board includes: acore layer, in a honeycomb structure, having upper and lower surfaces, and made of aluminum; and an outer layer, combined at at least one of the upper and lower surfaces and made of an epoxy resin reinforcing material. The epoxy resin reinforcing material is constituted with a reinforcing material and an epoxy resin composition. The epoxy resin composition includes an epoxy resin, a latent curing agent, an accelerator, a coupling agent, and optionally a toughening agent and a filler. The coupling agent includes an amido-containing silane coupling agent.

    Abstract translation: 提供一种复合蜂窝夹芯板及其制备方法。 所述复合蜂窝夹心板包括:具有上表面和下表面的蜂窝结构的顶层,并由铝制成; 以及在上表面和下表面中的至少一个上结合并由环氧树脂增强材料制成的外层。 环氧树脂增强材料由增强材料和环氧树脂组合物构成。 环氧树脂组合物包含环氧树脂,潜伏性固化剂,促进剂,偶联剂和任选的增韧剂和填料。 偶联剂包括含酰氨基的硅烷偶联剂。

    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF
    6.
    发明公开
    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF 审中-公开
    用于金属化聚合物基底的方法和由其制备的聚合物制品

    公开(公告)号:EP3108035A1

    公开(公告)日:2016-12-28

    申请号:EP15740215.7

    申请日:2015-01-27

    Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

    Abstract translation: 用于金属化聚合物基底的方法和由其制备的聚合物制品。 首先提供具有基础聚合物和分散在基础聚合物中的至少一种金属化合物的聚合物基材。 然后用能量束照射聚合物基材的表面,使得聚合物基材的表面的水接触角为至少120°。 然后对聚合物基材的表面进行化学镀。

    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF
    7.
    发明公开
    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF 审中-公开
    敷金属聚合物底物和产物的方法由其衍生的聚合物SUBJECT

    公开(公告)号:EP3108034A1

    公开(公告)日:2016-12-28

    申请号:EP15740539.0

    申请日:2015-01-27

    Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF
    8.
    发明公开
    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF 审中-公开
    用于金属化聚合物基底的方法和由其制备的聚合物制品

    公开(公告)号:EP3108033A1

    公开(公告)日:2016-12-28

    申请号:EP15740739.6

    申请日:2015-01-27

    Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

    Abstract translation: 提供了用于金属化聚合物基底的方法和通过该方法制备的聚合物制品。 首先提供具有基础聚合物和分散在基础聚合物中的至少一种金属化合物的聚合物基材。 然后用能量束照射聚合物基材的表面,使得聚合物基材的表面的水接触角为至少120°。 并且聚合物基材的表面经受化学镀。

Patent Agency Ranking