公开(公告)号：US20170287743A1

公开(公告)日：2017-10-05

申请号：US15474107

申请日：2017-03-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Nobuo KOBAYASHI ,  Konosuke SASAHIRA ,  Katsuhiro YAMAZAKI

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  H01L21/687 ,  B08B3/04 ,  B08B3/08

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/6719

Abstract: According to the embodiment, a substrate treating device 1 that rotates and washes a substrate, the device includes a spinning holding mechanism for holding a substrate, a treatment liquid supply nozzle for supplying a treatment liquid to the substrate, a shielding plate that is arranged opposite to the substrate held by the spinning holding mechanism and that moves in a contact/separate direction with respect to the substrate, a shielding plate rotating mechanism for rotating the shielding plate, and a control device for controlling the shielding plate rotating mechanism to rotate the shielding plate without moving the shielding plate from a standby position when the treatment liquid is supplied from the treatment liquid supply nozzle. It is possible to prevent contamination of a substrate during the treatment process.