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公开(公告)号：US20240218179A1
公开(公告)日：2024-07-04
申请号：US18291962
申请日：2022-07-29
Applicant: SHPP GLOBAL TECHNOLOGIES B.V.
Inventor： Shijie SONG , Jin Ju JUNG , Jong Woo LEE
CPC classification number: C08L81/02 , C08K7/14 , H01Q1/38 , C08L2203/30 , C08L2205/025 , C08L2205/035 , C08L2205/08 , C23C18/1641
Abstract: Disclosed herein are compositions comprising: a. from about 30 wt. % to about 60 wt. % of a polyphenylene sulfide (PPS); from greater than 20 wt. % to about 35 wt. % of a polyphenylene oxide (PPO); from about 0.01 wt. % to about 12 wt. % of a compatibilizer package, wherein the compatibilizer package comprises an ethylene-glycidyl methacrylate co-polymer, a styrene rubber copolymer, and an alicyclic saturated hydrocarbon resin present in a ratio of about 0.5:1:2 to about 3:1:4; and from about 20 wt. % to about 50 wt. % of an inorganic filler, wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition, and wherein the composition exhibits a plating adhesion of at least 5B when tested in accordance with an ASTM D3359 cross hatch adhesion test.
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公开(公告)号：US20210214608A1
公开(公告)日：2021-07-15
申请号：US16637348
申请日：2018-08-07
Applicant: SHPP Global Technologies B.V.
Inventor： Soonyoung HYUN , Jong Woo LEE , Adel Fawzy BASTAWROS , Hao ZHOU
Abstract: A quantum dot film includes at least one extruded polymer layer, the at least one extruded polymer layer including a plurality of stabilized quantum dots. The stabilized quantum dots may include one or more of the following: an encapsulation around each of the plurality of stabilized quantum dots, the encapsulation including an organic material or an inorganic material; a plurality of ligands having a length of about 5 nanometers (nm) to about 200 nm; a multi-shell structure; a shell having a thickness of about 1 to about 20 nm; and a concentration-gradient quantum dot.
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