公开(公告)号：US20240417534A1

公开(公告)日：2024-12-19

申请号：US18715938

申请日：2022-12-16

Applicant: SIKA TECHNOLOGY AG

Inventor： David HOFSTETTER ,  Andrea BATTISTI ,  Marcel OERTLI ,  Christian EYHOLZER ,  Fabien CHOFFAT

IPC: C08K3/22 ,  C08K5/521 ,  H01M10/653 ,  H05K7/20

Abstract: A two-component moisture-curable composition, especially suitable as thermally conductive gap filler, in particular with flame-retardant properties. It is thus highly suitable for use in e-mobility battery bonding or electronic equipment.

公开(公告)号：US20210230404A1

公开(公告)日：2021-07-29

申请号：US17263976

申请日：2019-09-02

Applicant: SIKA TECHNOLOGY AG

Inventor： Christian EYHOLZER ,  Goran CAKIC ,  Cornelia BÖFER ,  Michael GUTGSELL

IPC: C08L9/06 ,  C08J9/10 ,  C08L91/02

Abstract: A thermally expandable rubber composition, including a) at least one solid rubber A from the group consisting of styrene-butadiene rubber, cis-1,4-polybutadiene, synthetic isoprene rubber, natural rubber, ethylene-propylene-diene rubber (EPDM), nitrile rubber, butyl rubber and acrylic rubber; b) processing oil PO, comprising at least one Treated Distillate Aromatic Extract (TDAE); c) at least one vulcanization system VS; d) at least one filler G; e) at least one blowing agent BA. The thermally expandable rubber composition provides low VOC content and exhibits good applicability as well as other material properties after full curing, especially above 200° C. for 40 min, especially good adhesion on substrates, especially metal substrates.