公开(公告)号：US20240417608A1

公开(公告)日：2024-12-19

申请号：US18706777

申请日：2023-01-05

Applicant: SIKA TECHNOLOGY AG

Inventor： Klaas MENNECKE ,  Shohei MURAMATSU ,  Gene Frederick GAGABE ,  Takuya KUNITOMO ,  Yuki HAYASHI ,  Hans HÄBERLE

IPC: C09J175/08 ,  C09J5/00 ,  C09J11/06

Abstract: A one-component moisture curing composition including 100 weight parts of a polymer containing silane groups of the formula (I), 5 to 50 weight parts of at least one liquid epoxy resin, at least one polyketimine, 2 to 15 weight parts of at least one epoxy silane, 0 to 500 weight parts of fillers and 0 to 500 weight parts of plasticizers.