公开(公告)号：AU2003206552A1

公开(公告)日：2003-09-04

申请号：AU2003206552

申请日：2003-02-14

Applicant: SILEX MICROSYSTEMS AB

Inventor： SVEDIN NIKLAS ,  WESTIN HAKAN ,  KALVESTEN EDVARD ,  EBEFORS THORBJORN

IPC: B81B3/00 ,  B81B7/04 ,  G02F1/29 ,  H01L21/00 ,  H01L21/30 ,  H01L21/302 ,  H01L21/46 ,  H01L21/461

Abstract: A method of making a deflectable, free hanging micro structure having at least one hinge member, the method includes the steps of providing a first sacrificial wafer having a single crystalline material constituting material forming the micro structure. A second semiconductor wafer including necessary components for forming the structure in cooperation with the first wafer is provided. Finite areas of a structured bonding material is provided, on one or both of the wafers at selected locations, the finite areas defining points of connection for joining the wafers. The wafers are bonded using heat and optionally pressure. Sacrificial material is etched away from the sacrificial wafer, patterning the top wafer by lithography is performed to define the desired deflectable microstructures having hinges, and subsequently silicon etch to make the structures.

公开(公告)号：AU2003206553A1

公开(公告)日：2003-09-04

申请号：AU2003206553

申请日：2003-02-14

Applicant: SILEX MICROSYSTEMS AB

Inventor： KALVESTEN EDVARD ,  EBEFORS THORBJORN ,  GRISS PATRICK ,  HAASL SJOERD ,  SOHLSTROM HANS ,  STEMME GORAN

IPC: G02B6/42 ,  G02B6/12