公开(公告)号：SE537499C2

公开(公告)日：2015-05-26

申请号：SE0900590

申请日：2009-04-30

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS TORBJÖRN ,  KÄLVESTEN EDWARD ,  SVEDIN NIKLAS ,  ERIKSSON ANDERS

IPC: H01L23/10 ,  B81B7/00

公开(公告)号：EP2425450A4

公开(公告)日：2016-10-05

申请号：EP10770036

申请日：2010-04-30

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJÖRN ,  KÄLVESTEN EDWARD ,  SVEDIN NIKLAS ,  ERIKSSON ANDERS

IPC: H01L23/10 ,  B81B7/00 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/29035 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/83805 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.