公开(公告)号：SE523596C2

公开(公告)日：2004-05-04

申请号：SE0102925

申请日：2001-08-31

Applicant: SILEX MICROSYSTEMS AB

Inventor： NIKLAUS FRANK ,  STEMME GOERAN

IPC: B81B3/00 ,  B81B7/04 ,  B81C1/00 ,  H01L20060101 ,  H01L21/70

Abstract: The surfaces of a sacrificial substrate (100) and a non-sacrificial substrate (200) are provided with components (120, 210) which become interconnected after bonding the surfaces together via a temporary bonding material and removing at least part of the sacrificial substrate. A method for combining components to form an integrated device comprises the following steps : (i) providing at least one first component (120) on a first surface of a sacrificial substrate ; (ii) providing at least one second component (210) on a first surface of a non-sacrificial substrate ; (iii) forming a support structure (220) on the first surface of the sacrificial and/or non-sacrificial substrates so that the support structure protrudes from this first surface ; (iv) bonding the first surfaces with a temporary intermediate bonding material so that they face each other over a distance defined by the thickness of the support structure ; and (v) removing at least part of the sacrificial substrate so that the first and second components are interconnected.

公开(公告)号：SE0102925L

公开(公告)日：2003-04-30

申请号：SE0102925

申请日：2001-08-31

Applicant: SILEX MICROSYSTEMS AB

Inventor： NIKLAUS FRANK ,  STEMME GOERAN

IPC: B81B3/00 ,  B81B7/04 ,  B81C1/00 ,  H01L20060101 ,  H01L21/70