公开(公告)号：WO2016182851A3

公开(公告)日：2016-11-17

申请号：PCT/US2016/031001

申请日：2016-05-05

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： GOH, Eng Lim ,  DONLIN, Patrick ,  WARNER, Andrew

IPC: G06F1/20 ,  G06F1/26 ,  G06F1/30

Abstract: An apparatus and method thermally manage a high performance computing system having a plurality of nodes with microprocessors. To that end, the apparatus and method monitor the temperature of at least one of a) the environment of the high performance computing system and b) at least a portion of the high performance computing system. In response, the apparatus and method control the processing speed of at least one of the microprocessors on at least one of the plurality of nodes as a function of at least one of the monitored temperatures.