公开(公告)号：WO2017083383A1

公开(公告)日：2017-05-18

申请号：PCT/US2016/061131

申请日：2016-11-09

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： LUNSMAN, Harvey, John ,  STACY, Russell, Eric

IPC: H01L23/473 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/46 ,  H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20254 ,  H05K7/20772

Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.

Abstract translation: 本公开涉及用于冷却电子部件的装置和方法。 本发明的设备包括连接器和插入连接器的电子部件。 电子部件接触散热器，散热器随着电子部件插入连接器而向上移动。 当散热器向上移动时，位于散热器和液冷管/管道之间的软导热垫会压缩。 压缩时，散热垫会接触散热器和液体冷却管/管道。 然后，热量从电子元件通过散热片，热垫，冷却剂管，并进入液体冷却剂管内的液体。