BACKPLANE REINFORCEMENT AND INTERCONNECTS FOR SOLAR CELLS

    公开(公告)号:MY158500A

    公开(公告)日:2016-10-14

    申请号:MYPI2013700332

    申请日:2011-08-05

    Applicant: SOLEXEL INC

    Abstract: FABRICATION METHODS AND STRUCTURES RELATING TO BACKPLANES FOR BACK CONTACT SOLAR CELLS THAT PROVIDE FOR SOLAR CELL SUBSTRATE REINFORCEMENT AND ELECTRICAL INTERCONNECTS ARE DESCRIBED. THE METHOD COMPRISES DEPOSITING AN INTERDIGITATED PATTERN OF BASE ELECTRODES AND EMITTER ELECTRODES ON A BACKSIDE SURFACE OF A SEMICONDUCTOR SUBSTRATE, FORMING ELECTRICALLY CONDUCTIVE EMITTER PLUGS AND BASE PLUGS ON THE INTERDIGITATED PATTERN, AND ATTACHING A BACKPLANE HAVING A SECOND INTERDIGITATED PATTERN OF BASE ELECTRODES AND EMITTER ELECTRODES AT THE CONDUCTIVE EMITTER AND BASE PLUGS TO FORM ELECTRICAL INTERCONNECTS. [FIG. 16A]

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