公开(公告)号：WO2013055307A3

公开(公告)日：2013-10-24

申请号：PCT/US2011046873

申请日：2011-08-05

Applicant: SOLEXEL INC ,  MOSLEHI MEHRDAD M ,  WANG DAVID XUAN-QI ,  KRAMER KARL-JOSEF ,  SEUTTER SEAN ,  TOR SAM TONE ,  CALCATERRA ANTHONY

Inventor： MOSLEHI MEHRDAD M ,  WANG DAVID XUAN-QI ,  KRAMER KARL-JOSEF ,  SEUTTER SEAN ,  TOR SAM TONE ,  CALCATERRA ANTHONY

IPC: H01L31/042 ,  H01L31/05 ,  H01L31/18

CPC classification number: H01L31/022458 ,  H01L31/02008 ,  H01L31/02013 ,  H01L31/022441 ,  H01L31/028 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1892 ,  Y02E10/50

Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.

Abstract translation: 描述了与用于背接触太阳能电池的背板相关的制造方法和结构，其提供太阳能电池基底增强和电互连。 该方法包括在半导体衬底的背侧表面上沉积交叉指型的基极和发射极电极图案，在交叉指型图案上形成导电发射极插塞和基极插塞，并将具有第二叉指图案的基极和发射极电极 在导电发射极和基极插头处形成电互连。

公开(公告)号：WO2012021880A3

公开(公告)日：2012-05-10

申请号：PCT/US2011047699

申请日：2011-08-13

Applicant: SOLEXEL INC ,  KRAMER KARL-JOSEF ,  MOSLEHI MEHRDAD M ,  WANG DAVID XUAN-QI ,  TAMILMANI SUBRAMANIAN ,  TOR SAM TONE ,  KAVARI RAHIM ,  RICOLCOL RAFAEL ,  KAMIAN GEORGE ,  LEIGH JOSEPH

Inventor： KRAMER KARL-JOSEF ,  MOSLEHI MEHRDAD M ,  WANG DAVID XUAN-QI ,  TAMILMANI SUBRAMANIAN ,  TOR SAM TONE ,  KAVARI RAHIM ,  RICOLCOL RAFAEL ,  KAMIAN GEORGE ,  LEIGH JOSEPH

IPC: H01L31/18 ,  H01L31/0216 ,  H01L31/042

CPC classification number: H01L31/1896 ,  H01L31/18 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: Mechanisms are disclosed by which a semiconductor wafer, silicon in some embodiments, is repeatedly used to serve as a template and carrier for fabricating high efficiency capable thin semiconductor solar cells substrates. Mechanisms that enable such repeated use of these templates at consistent quality and with high yield are disclosed.

Abstract translation: 公开了一些机构，其中一些实施例中的半导体晶片，硅被重复地用作用于制造高效能的薄半导体太阳能电池基板的模板和载体。 公开了能够以一致的质量和高产率重复使用这些模板的机制。

公开(公告)号：EP2601687A4

公开(公告)日：2018-03-07

申请号：EP11871380

申请日：2011-08-05

Applicant: SOLEXEL INC

Inventor： MOSLEHI MEHRDAD M ,  WANG DAVID XUAN-QI ,  KRAMER KARL-JOSEF ,  SEUTTER SEAN ,  TOR SAM TONE ,  CALCATERRA ANTHONY

IPC: H01L31/02 ,  H01L31/0224 ,  H01L31/05 ,  H01L31/18

CPC classification number: H01L31/022458 ,  H01L31/02008 ,  H01L31/02013 ,  H01L31/022441 ,  H01L31/028 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1892 ,  Y02E10/50

Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.