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Patent Agency Ranking
公开(公告)号：GB2165694B
公开(公告)日：1988-05-05
申请号：GB8525084
申请日：1985-10-11
Applicant: SONY CORP
Inventor： AYABE MASAAKI , SANTA SUMIO , MATSUDA OSAMU
Abstract: A semiconductor laser device is disclosed herein in which a semiconductor laser chip is mounted on a surface of a semiconductor substrate at one region and a plurality of photo-detecting portions for receiving laser light emitted from the semiconductor laser chip are provided on the surface of the semiconductor substrate at another region separated from the semiconductor laser chip.
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公开(公告)号：DE3536738A1
公开(公告)日：1986-04-17
申请号：DE3536738
申请日：1985-10-15
Applicant: SONY CORP
Inventor： AYABE MASAAKI , SANTA SUMIO , MATSUDA OSAMU
Abstract: A semiconductor laser device is disclosed herein in which a semiconductor laser chip is mounted on a surface of a semiconductor substrate at one region and a plurality of photo-detecting portions for receiving laser light emitted from the semiconductor laser chip are provided on the surface of the semiconductor substrate at another region separated from the semiconductor laser chip.
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公开(公告)号：GB2165694A
公开(公告)日：1986-04-16
申请号：GB8525084
申请日：1985-10-11
Applicant: SONY CORP
Inventor： AYABE MASAAKI , SANTA SUMIO , MATSUDA OSAMU
Abstract: A semiconductor laser device is disclosed herein in which a semiconductor laser chip is mounted on a surface of a semiconductor substrate at one region and a plurality of photo-detecting portions for receiving laser light emitted from the semiconductor laser chip are provided on the surface of the semiconductor substrate at another region separated from the semiconductor laser chip.
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公开(公告)号：FR2571901B1
公开(公告)日：1988-12-02
申请号：FR8515319
申请日：1985-10-16
Applicant: SONY CORP
Inventor： SANTA SUMIO , MATSUDA OSAMU
Abstract: A semiconductor laser device is disclosed herein in which a semiconductor laser chip is mounted on a surface of a semiconductor substrate at one region and a plurality of photo-detecting portions for receiving laser light emitted from the semiconductor laser chip are provided on the surface of the semiconductor substrate at another region separated from the semiconductor laser chip.
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公开(公告)号：FR2571901A1
公开(公告)日：1986-04-18
申请号：FR8515319
申请日：1985-10-16
Applicant: SONY CORP
Inventor： SANTA SUMIO , MATSUDA OSAMU
Abstract: A semiconductor laser device is disclosed herein in which a semiconductor laser chip is mounted on a surface of a semiconductor substrate at one region and a plurality of photo-detecting portions for receiving laser light emitted from the semiconductor laser chip are provided on the surface of the semiconductor substrate at another region separated from the semiconductor laser chip.
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