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公开(公告)号:JP2002133651A
公开(公告)日:2002-05-10
申请号:JP2000324207
申请日:2000-10-24
Applicant: SONY CORP
Inventor: SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To provide a guide roll device that can transfer film stably without lowering the quality and yield, a supply method of electricity to the roll guide device and a removal method of electricity from film. SOLUTION: The guide roll device 1 that transfers a tape-shaped film is equipped with a roll section 2 that rotates around a central shaft and comes into contact with the tape-shaped film, a shaft section 3 that is connected to the roll section 2 and rotates together with the roll section 2 and a bearing section 6 supporting the shaft section 3, and a conductive liquid tank 5 in which by sealing a conductive liquid is sealed air tightly around the shaft section 3 in the bearing section 6 and the bearing section 6 and the shaft section 3 are connected electrically through the conductive liquid tank 5. The supply of electricity to the guide roll device 1 is made by supplying a specified electric potential to the guide roll device through the conductive liquid tank 5. The removal of electricity from the conductive liquid tank 5 is made by release of a charge from the film to the outside.
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公开(公告)号:JPH10158828A
公开(公告)日:1998-06-16
申请号:JP32426496
申请日:1996-12-04
Applicant: SONY CORP
Inventor: TAMURA HIDEMASA , YOKOYAMA NORIO , SHIMIZU EIICHI , SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To obtain a sputtering target small in the quantity of particles formed at the time of sputtering by forming the face to be subjected to sputtering in a sputtering target into a rugged face, executing mirror finishing and regulating the arithmetic average roughness to specified value or below. SOLUTION: A billet composed of a Ti material is subjected to prescribed heat treatment and forging treatment and is thereafter subjected to rolling treatment and machining to form into a disk-shaped sputtering target 1. The sputtering face 2 therein is subjected to machining into a rugged face having a prescribed curvature R, and furthermore, mirror finishing is executed to regulate the arithmetic average roughness Ra thereof to
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公开(公告)号:JP2007023364A
公开(公告)日:2007-02-01
申请号:JP2005210697
申请日:2005-07-21
Inventor: TANABE KEISUKE , TANAKA TAKAYUKI , SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To provide a vapor deposition system where the phenomenon that vapor 10 of a vapor deposition material 5 in a crucible 6 and an ion 13 ionized by an electron beam 8 reach an electron gun 7 is prevented.
SOLUTION: A vapor deposition material 5 is arranged at the obliquely lower part of a cooling can 2 around which a polymer film 1 as the object to be vapor-deposited is wound, an electron gun 7 of emitting a beam to a droop direction is arranged at the obliquely upper part of the vapor deposition material 5, a deflector 19 is arranged at the obliquely lower part of the electron gun 7 and also at an almost intermediate height position of the electron gun 7 and the vapor deposition material 5, and a shielding board 21 of shielding a path connecting the electron gun 7 and the vapor deposition material 5 with a straight line and a shielding board 22 of shielding a path connecting the deflector 19 and the vapor deposition material 5 with a straight line are arranged. Owing to deflection by the deflector 19, the electron beam 8 can be emitted from the horizontal direction of the vapor deposition material 5 in which vapor generation concentration is thin, and the generation degree of electron beam scattering is reduced. Further, the vapor 10 does not give damage to the electron gun 7 and the deflector 19 since it is shielded by the shielding boards 21, 22.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题:提供一种蒸镀系统,其中防止坩埚6中的气相沉积材料5的蒸气10和由电子束8离子化的离子13到达电子枪7的现象。 解决方案:蒸镀材料5布置在冷却罐2的倾斜下部,冷却罐2周围围绕作为气相沉积物体的聚合物膜1,将光束发射到下垂的电子枪7 方向配置在蒸镀材料5的倾斜上部,偏转器19配置在电子枪7的倾斜下部以及电子枪7和蒸镀材料5的几乎中间高度位置, 并且布置屏蔽用直线连接电子枪7和蒸镀材料5的路径的屏蔽板21,屏蔽用直线连接导流板19和蒸镀材料5的路径的屏蔽板22。 由于偏转器19的偏转,电子束8可以从气相沉积材料5的水蒸气发生浓度较小的水平方向发射,电子束散射的产生程度降低。 此外,蒸汽10不会对电子枪7和偏转器19造成损害,因为它被屏蔽板21,22屏蔽。(C)2007,JPO&INPIT
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公开(公告)号:JP2002358633A
公开(公告)日:2002-12-13
申请号:JP2001161118
申请日:2001-05-29
Applicant: SONY CORP
Inventor: SHIMANUKI MAKOTO , TANABE KEISUKE , SUZUKI TOSHIAKI , SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To prevent a polymer film from floating from a cooling roll and from receiving a thermal damage by radiation heat from a molten metallic magnetic material even if there is a power source off by an abnormal discharge specific to an electron gun relating to the manufacture of a magnetic recording medium by vacuum vapor deposition. SOLUTION: In the method of manufacturing the magnetic recording medium consisting of a process step of electrifying the polymer film in the traveling state of the polymer film, a process step of depositing a magnetic layer on the surface of the polymer film and a process step of blowing inert gas to the rear surface of the polymer film at the time of separating the polymer film and the cooling roll from each other, the high polymeric film travels while the polymer film is kept in tight contact with the cooling roll by electrification of the traveling polymer film and even if a power source off arises from an abnormal discharge specific to the electron gun in the deposition process step and the supply of secondary electrons stops, the floating of the polymer film from the cooling roll does not occur any more, and thereby, the polymer film is prevented from suffering from a thermal damage by the radiation heat from the molten metallic magnetic material and the holing or melt fusion of the polymer film is eliminated.
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公开(公告)号:JP2002146517A
公开(公告)日:2002-05-22
申请号:JP2000337818
申请日:2000-11-06
Applicant: SONY CORP
Inventor: SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To provide an evaporator, to which a rod of metallic material can be supplied without causing trouble, and a method for feeding the material to the evaporator, and also to provide those device and method of manufacturing a magnetic recording medium that enable a metallic magnetic film to be vapor- deposited without causing trouble. SOLUTION: In the device that evaporates the melt liquid 23 of a metallic material by irradiating the liquid 23 with an electron beam 11, or in the device that forms a magnetic recording medium, in which a magnetic layer consisting of a metallic magnetic film is formed, is produced by vapor-depositing a metallic magnetic material on a nonmagnetic supporting body; a guide 30 with a cooling mechanism installed is arranged in a rod supply part, which feeds the rod 25 processed from the metallic material or the metallic magnetic material in a rod shape to the melt liquid 23 of the same material, so that the rod 25 is held while being cooled by this guide 30 and fed to the melt liquid 23.
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公开(公告)号:JP2000255848A
公开(公告)日:2000-09-19
申请号:JP6346599
申请日:1999-03-10
Applicant: SONY CORP
Inventor: SASAKI FUMIO
Abstract: PROBLEM TO BE SOLVED: To obtain the winding apparatus of a base film for a magnetic tape which has difficulty in wrinkling at the base film for the magnetic tape, in winding the base film for the magnetic tape around a winding core. SOLUTION: This apparatus is provided with a winding core 1 whose peripheral surface is covered with an elastic body layer 1a, a touch roll 8 whose peripheral surface is covered with an elastic body layer 8a, a touch roll device TR provided with a cylinder pressing the touch roll 8 against the winding core 1. A base film T for a magnetic tape is set so as to be wound around the winding core by the rotation of the winding core, in such a condition as to be sandwiched between the winding core 1 and the touch roll 8.
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公开(公告)号:JPH11323540A
公开(公告)日:1999-11-26
申请号:JP13045498
申请日:1998-05-13
Applicant: SONY CORP
Inventor: TAKENOUCHI MASAKI , SASAKI FUMIO , KOJIMA DAISUKE
IPC: C23C14/34 , C23C14/35 , H01L21/203
Abstract: PROBLEM TO BE SOLVED: To provide a sputtering device improving reliability in the cathode part and the efficiency of sputtering. SOLUTION: This sputtering device is provided with an anode part in which an object is arranged and a cathode part 14 arranged opposite to the anode part, arranged adhesively to a backing plate 16 and having a target part 15 in which the magnetic fields are formed on the surface by magnetic field generating parts 18 and 19 arranged on the circumference of the backing plate 16. In this case, the backing plate 16 and the target part 15 are formed so as to respectively have the thickness of >=6.5 mm and formed so as to regulate the total thickness of the backing plate 16 and the target part 15 to
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公开(公告)号:JPH10158829A
公开(公告)日:1998-06-16
申请号:JP32426396
申请日:1996-12-04
Applicant: SONY CORP
Inventor: SHIMOMUKAI HITOSHI , SASAKI FUMIO , SHIMIZU EIICHI
IPC: B23K20/02 , B23K20/233 , C23C14/34 , H01L21/203
Abstract: PROBLEM TO BE SOLVED: To provide a method capable of producing a sputtering target assembly capable of obtaining high adhesive strength and high joining strength at high temps. and furthermore having sufficient tensile strength as a sputtering target assembly in which a target material used for sputtering and a backing plate are joined. SOLUTION: At the time of producing a sputtering target assembled body 1 in which a target 2 used for sputtering and a backing plate 3 are joined, the joined face between the target material 2 and the backing plate 3 is flattened so as to regulate the arithmetic average roughness Ra to 0.1 to 1.0μm, and then, the target material 2 and the backing plate 3 are joined by solid phase diffusion joining.
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