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公开(公告)号：JP2007158092A
公开(公告)日：2007-06-21
申请号：JP2005352226
申请日：2005-12-06
Inventor： TANAKA KIYOTSUGU
IPC: H01S5/0683
Abstract: PROBLEM TO BE SOLVED: To provide a laser beam emitting apparatus and a laser driving method with which output characteristics can be maintained constant in spite of a temperature change.
SOLUTION: A laser beam emitting apparatus includes a laser element 1 emitting laser beams in a plurality of modes, a driving device 4 for supplying a driving current I superimposing a bias current I-bias and a modulated current I-mod to the laser element 1, and a photodetector 3 for photodetecting an outer portion of laser beams emitted from the laser element 1. The driving device 4 controls the modulated current I-mod based on the quantity of light detected by the photodetector 3.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供尽管温度变化，输出特性可以保持恒定的激光束发射装置和激光驱动方法。 解决方案：激光束发射装置包括以多个模式发射激光束的激光元件1，用于将叠加偏置电流I偏压的驱动电流I和调制电流I-mod提供给驱动装置4的驱动装置4 激光元件1，以及用于对从激光元件1发射的激光束的外部进行光电检测的光电检测器3.驱动装置4基于由光电检测器3检测到的光量来控制调制电流I-mod。 （C）2007，JPO＆INPIT
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公开(公告)号：JPH11273138A
公开(公告)日：1999-10-08
申请号：JP7720098
申请日：1998-03-25
Inventor： TANAKA KIYOTSUGU
Abstract: PROBLEM TO BE SOLVED: To control the light output of a semiconductor laser chip by a front auto-power control(APC) driving method, to reduce the size, thickness, cost, and the number of parts of a device such as an optical pickup when the optical semiconductor device is used for the optical pickup device or the like and to suppress the deterioration of characteristic such as the increase in the stray light.
SOLUTION: In a laser coupler obtained by housing a laser coupler chip in a flat package 11 and sealing the upper surface of the package 11 by a window cap 12, a photodiode 15 for monitoring the intensity of laser beam L
f radiated from the front side end face of a semiconductor laser chip 4 is arranged on the upper surface 12a of the cap 12 and the light output of the chip 14 is controlled in accordance with a monitor current outputted from the photodiode 15. It is also available to arrange the photodiode 15 on the lower face 12b or side face of the cap 12. The laser coupler and an objective lens are used for an optical pickup.
COPYRIGHT: (C)1999,JPOAbstract translation: 要解决的问题：为了通过前置自动功率控制（APC）驱动方法来控制半导体激光器芯片的光输出，以减小诸如光学拾取器的装置的尺寸，厚度，成本和部件的数量 当光学半导体器件用于光学拾取器件等时，并且抑制诸如杂散光的增加的特性的劣化。 解决方案：在通过将扁平封装11中的激光耦合器芯片容纳并通过窗口盖12密封封装件11的上表面而获得的激光耦合器中，用于监测从前端发射的激光束Lf的强度的光电二极管15 半导体激光芯片4的表面设置在盖12的上表面12a上，并且根据从光电二极管15输出的监视电流来控制芯片14的光输出。还可以将光电二极管15布置在 下表面12b或盖12的侧面。激光耦合器和物镜用于光学拾取器。
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3.发明专利
公开(公告)号：JPH11144307A
公开(公告)日：1999-05-28
申请号：JP31082697
申请日：1997-11-12
Applicant: SONY CORP
Inventor： NEMOTO KAZUHIKO , TANAKA KIYOTSUGU
IPC: G11B7/14
Abstract: PROBLEM TO BE SOLVED: To provide the light emitting device and the light receiving and emitting element which are small in the size, light in the weight and low in the cost and correctly conduct a recording and reproducing of two kinds of optical disks different in wavelength, strength, etc., and to provide the optical pickup and the optical disk device using the light emitting device and the element. SOLUTION: The device is provided with light receiving elements 21g and 21h formed on a first semiconductor substrate 21a, a first light emitting element 21b formed on a second semiconductor substrate 21b mounted on the substrate 21a, a second light emitting element 21d mounted on the element 21b and arranged to emit the light beams, which are almost parallel to those from the element 21b and have a different kind from the element 21b, and an optical branching means 21e which guides the light beams emitted from the elements 21b and 21d to a prescribed direction and guides the light beams from a prescribed direction to the elements 21g and 21h.
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公开(公告)号：JPH10270748A
公开(公告)日：1998-10-09
申请号：JP6862797
申请日：1997-03-21
Applicant: SONY CORP
Inventor： TANAKA KIYOTSUGU
Abstract: PROBLEM TO BE SOLVED: To prevent reflection of high frequency by constituting a transmission line for high frequency signal to a light-emitting element to be formed from a microstrip line of a given characteristic impedance and impedance-matched at its termination. SOLUTION: A transmission line to a semiconductor laser in a wiring metal layer 16 is made a microstrip line 18, and it is connected to a microstrip line 5 of a circuit board 2 through a side surface electrode 7. Here, the microstirp line 18 is so designed that its characteristic impedance is equal to that of the microstrip line 5 on the circuit board, for impedance matching. By making the transmission lines 5 and 18 to the semiconductor laser LD microstrip lines, and further obtaining impedance matching at its termination with a chip resistance, impedance matching is obtained at the middle or the termination of a wiring, so that reflection of high frequency is prevented.
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公开(公告)号：JP2011009143A
公开(公告)日：2011-01-13
申请号：JP2009153619
申请日：2009-06-29
Inventor： TANAKA KIYOTSUGU , FUJII MASARU
IPC: F21S2/00 , F21Y101/02 , G02F1/13357 , H01L33/00 , H01L33/54
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To reduce electric power consumption by adjusting light emission characteristics for each color of a light emitting unit so as to eliminate the in-plane unevenness of color and unwanted luminance adjustment.SOLUTION: A lighting device includes a plurality of light-emitting units 2 that correspond to different colors; lead frames 21, each of which serves as a base material where each of the light-emitting units 2 is mounted; and reflecting units 3 that are attached to the lead frames 21, respectively, in the periphery of the light-emitting units 2 and have different shapes corresponding to the colors of the light-emitting units 2. Here, as the shapes for the reflecting units 3, shapes differ in the reflection angles or in plan views.
Abstract translation: 要解决的问题：通过调节发光单元的每种颜色的发光特性来减少电力消耗，以消除颜色的面内不均匀性和不期望的亮度调节。解决方案：照明装置包括多个发光单元， 对应于不同颜色的发光单元2; 引线框架21，其每个用作安装每个发光单元2的基材; 以及分别在发光单元2的周边附接到引线框架21的反射单元3，并且具有与发光单元2的颜色相对应的不同形状。这里，作为反射单元的形状 3，反射角度或平面图中的形状不同。
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Patent Agency Ranking
公开(公告)号：JP2005338291A
公开(公告)日：2005-12-08
申请号：JP2004155099
申请日：2004-05-25
Inventor： NAGASHIMA YOSHIYA , KANEHIRA HIRONORI , TANAKA KIYOTSUGU
IPC: G02B6/42
Abstract: PROBLEM TO BE SOLVED: To provide a bidirectional optical module which can reduce the manufacturing cost by simplifying the manufacturing process, reducing the assembling time and reducing the number of components in the whole module.
SOLUTION: The module includes a first lens 15 which converts the output light emitting from a light emitting element 12 into a parallel beam, a first prism which totally reflects the output light as the parallel beam from the first lens 15 on a reflecting face 24, and a spherical lens 17 which has the same optical axis as the output light reflected on the reflecting face 24 and which converts the output light supplied in the right opposite direction of the propagation direction into a parallel beam. A second prism 23 having one end face 25 tilted with respect to the propagation direction of the output light and the input light is placed to allow the boundary on the end face 25 to be positioned in the parallel beams of input light and output light, so that the output light reflected on the reflecting face 24 is partially transmitted while a part of the input light converted into a parallel beam by the spherical lens 17 is totally reflected on the end face 25 and guided to a light receiving element 13. The spherical lens 17 optically couples the transmitted output light to an optical fiber 18.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种双向光学模块，其可以通过简化制造过程来降低制造成本，减少组装时间并减少整个模块中的部件数量。 解决方案：该模块包括将从发光元件12发射的输出光转换成平行光束的第一透镜15，将来自第一透镜15的平行光作为反射的全反射输出光的第一棱镜 面24和与反射面24反射的输出光具有相同光轴的球面透镜17，其将沿传播方向的相反方向供给的输出光转换为平行光束。 具有相对于输出光和输入光的传播方向倾斜的一个端面25的第二棱镜23被放置成允许端面25上的边界位于输入光和输出光的平行光束中，因此 反射面24反射的输出光被透射，而由球面透镜17转换为平行光的输入光的一部分在端面25上被全反射并被引导到光接收元件13.球面透镜 17将传输的输出光光学地耦合到光纤18.版权所有：（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005326787A
公开(公告)日：2005-11-24
申请号：JP2004146922
申请日：2004-05-17
Inventor： TAKAHASHI AKIRA , TANAKA KIYOTSUGU
Abstract: PROBLEM TO BE SOLVED: To reduce the influence of crosstalk while miniaturizing the whole module and simplifying the assembly process for the module by decreasing the optical elements as much as possible.
SOLUTION: A light emitting element 12 which emits output light and a light receiving element 13 which receives input light are arranged and fixed on a substrate 11 substantially parallel to the end face 18 of an optical fiber 17, only the fixed light emitting element 12 is coated with a first optical block 15, the light receiving element 13 is coated with only a second optical block 16 which is formed from a material having a refractive index lower than that of the first optical block 15, and an exposed optical waveguide part 19 is abutted to the end face 18 of the optical waveguide 17 and fixed so as to include a boundary 33 which is formed by bringing the first optical block 15 and the second optical block 16 into contact with each other.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：为了减少串扰的影响，同时使整个模块小型化，并且通过尽可能减小光学元件来简化模块的组装过程。 解决方案：发射输出光的发光元件12和接收输入光的光接收元件13布置并固定在基本上平行于光纤17的端面18的基板11上，仅固定发光 元件12涂覆有第一光学块15，光接收元件13仅涂覆有由折射率低于第一光学块15折射率的材料形成的第二光学块16，以及暴露的光波导 部分19抵靠光波导17的端面18并固定，以便包括通过使第一光学块15和第二光学块16彼此接触而形成的边界33。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JPH0575092A
公开(公告)日：1993-03-26
申请号：JP25857991
申请日：1991-09-10
Applicant: SONY CORP
Inventor： OKUHORA AKIHIKO , TANAKA KIYOTSUGU
IPC: H01L21/302 , H01L21/3065 , H01L21/318 , H01L27/14 , H01L27/15
Abstract: PURPOSE:To precisely control the thickness of an reflection-proof film on a photodetector in the titled device for which the photodetector, electronic device, and others are formed on the same substrate. CONSTITUTION:An reflection-proof film 12 is formed subsequent to the formation of a photodetector 2 and an electronic device part 3 on a semiconductor substrate 1. An aluminum film 13 is deposited on the reflection-proof film 12. This aluminum film 13 functions as an etching stopper in etching the opening for isolating films 15 and 17, and the like. Therefore, even when an opening 21 is formed above the photodetector 4, the thickness of the reflection-proof film is not varied. Hence, the effect of the reflection-proof is improved.
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公开(公告)号：JPH11176003A
公开(公告)日：1999-07-02
申请号：JP33902997
申请日：1997-12-09
Applicant: SONY CORP
Inventor： TANAKA KIYOTSUGU
Abstract: PROBLEM TO BE SOLVED: To obtain an element easy to wire-bond plural optical integrated elements and capable of constituting it as a single part even when it is used for one package by arranging plural optical integrated elements in the package in the mounted state and connecting the electrode pads of the respective optical integrated elements to the terminals of the package through a conductive pattern of a substrate. SOLUTION: Plural optical integrated elements 11 are arranged in the same package 5 in the state being mounted on a substrate 6 having the same conductive pattern 51. Then, the electrode pads of the optical integrated elements 11 are constituted to be connectable to an inner lead part Q of the package 5 through the conductive pattern 51 of the substrate 6 by wire bonding. Thus, bonding of metallic thin lines 53, 55 at the time of the wire bonding is facilitated and plural optical integrated elements 11 can be arranged in the same package. Heat radiation can be performed excellently by using the substrate arranging an excellent heat conductive material on its rear surface as the substrate 6 having the conductive patter 51.
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公开(公告)号：JPH1069674A
公开(公告)日：1998-03-10
申请号：JP24407796
申请日：1996-08-27
Applicant: SONY CORP
Inventor： TANAKA KIYOTSUGU , KOJIMA CHIAKI
IPC: G11B7/09 , G11B7/12 , G11B7/123 , G11B7/135 , G11B7/1353 , G11B7/1359 , H05K1/02 , H05K1/14
Abstract: PROBLEM TO BE SOLVED: To realize a miniature shape and thin shape, to simplify a manufacturing process and to reduce cost. SOLUTION: A laser beam receiving and emitting package 3, biaxis device 5 transferring an objective lens 4 and connector 6 for external connection are respectively placed and fixed on a wiring substrate 1 formed wiring patterns 2a, 2b so as to electrically connect to wiring patterns 2a, 2b. A laser coupler 11 formed an optical prism 15 and laser chip 16 on a photo diode IC14 provided with optical signal detecting photo diodes 12, 13 is packaged in the laser beam receiving and emitting package 3. A sub-wiring substrate attached the laser coupler 11 may be inserted into the hole formed in the wiring substrate 1 and fixed instead of using the laser beam receiving and emitting package 3.
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