公开(公告)号：US20140368088A1

公开(公告)日：2014-12-18

申请号：US14293630

申请日：2014-06-02

Applicant: Sony Corporation

Inventor： Kazuo TAKAHASHI ,  Satoshi MITANI ,  Hidetoshi KABASAWA

IPC: H03H9/21

CPC classification number: H03H9/21 ,  G01C19/5607 ,  H03H9/02259 ,  H03H9/2484 ,  H03H9/2489

Abstract: A piezoelectric device includes a vibrator, a piezoelectric drive unit, and a first piezoelectric detector. The vibrator includes a first surface, a first groove formed along a first axis direction, and a second groove formed to be parallel to the first groove. The piezoelectric drive unit includes a first electrode pair provided in the first groove and opposed to each other in a second axis direction orthogonal to the first axis direction and parallel to the first surface, and a first piezoelectric body provided between the first electrode pair, and is capable of vibrating the vibrator. The first piezoelectric detector includes a second electrode pair provided in the second groove and opposed to each other in the second axis direction, and a second piezoelectric body provided between the second electrode pair, and is capable of detecting a vibration of the vibrator.

Abstract translation: 压电装置包括振动器，压电驱动单元和第一压电检测器。 振动器包括第一表面，沿着第一轴线方向形成的第一凹槽和形成为平行于第一凹槽的第二凹槽。 所述压电驱动单元包括：第一电极对，设置在所述第一槽中，并且在与所述第一轴方向正交且与所述第一表面平行的第二轴方向上彼此相对;以及第一压电体，设置在所述第一电极对之间， 能振动振动器。 第一压电检测器包括设置在第二槽中并在第二轴向彼此相对的第二电极对，以及设置在第二电极对之间并且能够检测振动器的振动的第二压电体。

公开(公告)号：US20160155927A1

公开(公告)日：2016-06-02

申请号：US14785903

申请日：2014-03-20

Applicant: SONY CORPORATION

Inventor： Hidetoshi KABASAWA ,  Hiroshi OZAKI ,  Kazuo TAKAHASHI ,  Satoshi MITANI

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/053 ,  G01C19/5769

CPC classification number: H01L41/1132 ,  B81B7/008 ,  B81B2201/02 ,  B81B2207/012 ,  B81C1/00238 ,  G01C19/5769 ,  G01C19/5783 ,  G01L9/0073 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/162 ,  H01L41/0474 ,  H01L41/0533 ,  H01L41/113 ,  H01L41/1138 ,  H01L2224/16225

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

Abstract translation: 提供了一种能够实现小型化和降低成本的传感器装置和电子设备。 根据本技术的实施例的传感器装置包括传感器元件和半导体元件。 半导体元件包括第一表面，第二表面和通孔。 第一表面包括第一端子，传感器元件安装在该第一端子上并且是非活动表面。 第二表面包括用于外部连接的第二端子，并且是活动表面。 通孔将第一表面和第二表面彼此电连接。