Method and apparatus for recovering insulation and conductor from scrap insulated wire
    1.
    发明授权
    Method and apparatus for recovering insulation and conductor from scrap insulated wire 失效
    用于从绝缘丝线上回收绝缘和导体的方法和装置

    公开(公告)号:US3858776A

    公开(公告)日:1975-01-07

    申请号:US33497273

    申请日:1973-02-22

    Applicant: SOUTHWIRE CO

    CPC classification number: H01B15/001 Y02W30/821 Y10T225/12 Y10T225/304

    Abstract: Insulated wire, cable, and the like, is stripped of its insulation without damaging the wire. The insulated wire is preferably cooled to a low temperature, rendered brittle, and then continuously passed over roller means to effect fracturing and removal of the insulation. The bare wire is continuously recovered in an undamaged condition and the particles of insulation recycled where necessary. Wire straightening is optionally provided for straightening the bent wire after the insulation is removed.

    Abstract translation: 绝缘电线,电缆等都被剥去绝缘体而不损坏电线。 绝缘线优选地被冷却到低温,变脆,然后连续地通过辊装置以实现绝缘的压裂和去除。 裸线在未损坏的条件下连续回收,必要时再循环绝缘颗粒。 可选地提供线矫直用于在绝缘被去除之后矫正弯曲的线。

    POLYETHYLENE STABILIZED BY 2,6-DI(1-METHYL HEPTADECYL)-4-ALKYL PHENOL

    公开(公告)号:CA1006291A

    公开(公告)日:1977-03-01

    申请号:CA160566

    申请日:1973-01-04

    Applicant: SOUTHWIRE CO

    Abstract: 1408061 Crosslinking polyethylene SOUTHWIRE CO 29 Dec 1972 [29 Dec 1971] 60109/72 Heading C3P Curable compositions suitable for extruding on to electrical conductors comprise (a) an ethylene polymer, (b) a bisperoxide cross-linking agent of formula where R is methyl, phenyl, nitrophenyl or halophenyl, and (c) a 4-aliphatic hydrocarbyl 2,6- di - (1 - methylheptadecyl) phenol. The polymer may be a homopolymer or a copolymer of ethylene with propylene, butene, ethyl acrylate or vinyl acetate, or a mixture of polyethylene with polyvinyl chloride, polymethyl acrylate, polystyrene, copolymers of butadiene with styrene or acrylonitrile, neoprene, natural rubber or organopolysiloxanes. The compositions may also contain fillers, e.g. silica, carbon black, alumina and calcium silicate. The composition may be extruded on to conductors at 170‹ to 340‹ F. and cured by heating at 350‹ to 480‹ F. Examples describe the curing of compositions comprising polyethylene, carbon black and (1 and 3 to 5) tetramethyl isophthalyl di-t-butyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4- methylphenol, (2) tetramethyl isophthalyl di-tbutyl bisperoxide and 2,6-di-(1-methylheptyl)- 4-ethylphenol, (7 and 9 to 11) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6-di-(1- methylheptyl) - 4 - methylphenol, and (8) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4 - ethylphenol.

    4.
    发明专利
    未知

    公开(公告)号:DE2264155A1

    公开(公告)日:1973-07-12

    申请号:DE2264155

    申请日:1972-12-29

    Applicant: SOUTHWIRE CO

    Abstract: 1408061 Crosslinking polyethylene SOUTHWIRE CO 29 Dec 1972 [29 Dec 1971] 60109/72 Heading C3P Curable compositions suitable for extruding on to electrical conductors comprise (a) an ethylene polymer, (b) a bisperoxide cross-linking agent of formula where R is methyl, phenyl, nitrophenyl or halophenyl, and (c) a 4-aliphatic hydrocarbyl 2,6- di - (1 - methylheptadecyl) phenol. The polymer may be a homopolymer or a copolymer of ethylene with propylene, butene, ethyl acrylate or vinyl acetate, or a mixture of polyethylene with polyvinyl chloride, polymethyl acrylate, polystyrene, copolymers of butadiene with styrene or acrylonitrile, neoprene, natural rubber or organopolysiloxanes. The compositions may also contain fillers, e.g. silica, carbon black, alumina and calcium silicate. The composition may be extruded on to conductors at 170‹ to 340‹ F. and cured by heating at 350‹ to 480‹ F. Examples describe the curing of compositions comprising polyethylene, carbon black and (1 and 3 to 5) tetramethyl isophthalyl di-t-butyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4- methylphenol, (2) tetramethyl isophthalyl di-tbutyl bisperoxide and 2,6-di-(1-methylheptyl)- 4-ethylphenol, (7 and 9 to 11) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6-di-(1- methylheptyl) - 4 - methylphenol, and (8) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4 - ethylphenol.

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