公开(公告)号：JPH10247663A

公开(公告)日：1998-09-14

申请号：JP35750397

申请日：1997-12-25

Applicant: ST MICROELECTRON INC

Inventor： ANTHONY M CHU

IPC: H01L21/60 ,  H01L23/08 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To make it possible to form a package for integrated circuit use by a method wherein holes are provided in first and second boards formed with a plurality of conductive paths, those holes are aligned with each other and the first board is bonded to the second board using a bonding agent. SOLUTION: A plurality of conductive paths 404b and 404d are formed on first and second boards 415 and 417. Holes 403a to 403e are provided in the boards 415 and 417 and pins 402a to 402e are received in these holes 403a to 403e to bond the board 415 to the board 417 with a bonding agent. The pin 402a is connected with an earth plate under the board 417, the pin 402b is connected with a bonding pad 405b on the board 415, the pin 402c is connected with the earth plate under the board 417 and the pin 402d is connected with a bonding pad 405d on the board 415. Moreover, the pin 402e is connected with the power surface of the board 417.