公开(公告)号：JPH1168009A

公开(公告)日：1999-03-09

申请号：JP17556698

申请日：1998-06-23

Applicant: ST MICROELECTRON INC

Inventor： HUNDT MICHAEL ,  ZHOU TIAO

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/495

Abstract: PROBLEM TO BE SOLVED: To provide a lead frame, improved in heat dissipating properties, and a manufacturing method thereof. SOLUTION: This lead frame 40 of a plastic integrated circuit package is manufactured through two steps. The load fingers 42 of the lead frame 40 are formed of a rectangular metal sheet in a first step. In a second step, the die pad 44 of the lead frame 40 is clamped, the lead frame 40 is cut with a pair of engaged punching dies to separate the die pad 44 from the lead fingers 42 of the lead frame 40, and the die pad 44 is separated from the lead fingers 42 and set downward, whereby a horizontal gap is basically prevented from being formed between the lead fingers 42 and the die pad 44. The die pad 44 is set downward from the lead fingers 42, so that a vertical separation is formed between the die pad 44 and the lead fingers 42.