公开(公告)号：JP2003188319A

公开(公告)日：2003-07-04

申请号：JP2002347852

申请日：2002-11-29

Applicant: ST MICROELECTRONICS INC

Inventor： SIEGEL HARRY M ,  LANE FRED P ,  EVANS RICHARD P

IPC: H01L23/29 ,  G06K9/00 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To improve durability of a physical interface exposed in the environment of a semiconductor device, such as an integrated circuit, etc. SOLUTION: A touch-sensitive semiconductor chip equipped with a physical interface exposed in the environment is provided. The surface of the interface is coated with a fluorocarbon polymer. The polymer has high scratching durability and a low dielectric constant that is little damped by electric fields. The polymer can be used instead of the conventional passivation and, when the polymer is used, a thin layer having a low dielectric constant can be provided between an object which touches the physical interface and a capacitive detecting circuit existing beneath the polymer. COPYRIGHT: (C)2003,JPO