公开(公告)号：EP2947181B1

公开(公告)日：2017-02-22

申请号：EP14169722.7

申请日：2014-05-23

Applicant: STAMFORD DEVICES LIMITED

Inventor： Hogan, Brendan ,  Xu, Hong

IPC: C25D1/08 ,  A61M15/00 ,  B05B17/00 ,  A61M11/00

CPC classification number: C25D1/08 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638

公开(公告)号：EP2947181A1

公开(公告)日：2015-11-25

申请号：EP14169722.7

申请日：2014-05-23

Applicant: STAMFORD DEVICES LIMITED

Inventor： Hogan, Brendan ,  Xu, Hong

IPC: C25D1/08 ,  A61M15/00 ,  B05B17/00 ,  A61M11/00

CPC classification number: C25D1/08 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns (2) having a desired size, pitch, and profile, which yields a wafer about 60µm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal (3) overlies the top surfaces of the columns until the desired apertures (4) are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways (24) formed beneath the apertures (32), formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures (32).

Abstract translation: 通过在具有期望的尺寸，间距和轮廓的抗蚀剂柱（2）的掩模上镀覆金属来制造孔板，其产生厚度约为60μm的晶片。 这大约是完全期望的目标孔板厚度。 继续进行电镀，使得金属（3）覆盖在柱的顶表面上，直到达到所需的孔（4）。 这只需要一个掩模/电镀周期来实现所需的板厚度。 此外，板具有形成在孔（32）下方的通道（24），其形成为该方法的整体部分，通过掩模材料去除。 这些适合于夹带离开孔（32）的雾化液滴。