3.
    发明专利
    未知

    公开(公告)号:DD297173A5

    公开(公告)日:1992-01-02

    申请号:DD34327290

    申请日:1990-08-06

    Applicant: STAMICARBON

    Abstract: The invention relates to a polyamide composition comprising tetramethylene adipamide, tetramethylene-terephthalamide and tetramethylene isophthalamide units. The polyamide composition has a melting temperature in the same order as the homopolymer tetramethylene adipamide, a comparable crystallinity but very improved melt stability and stiffness.

    THERMOPLASTIC MOULDING COMPOUND
    5.
    发明专利

    公开(公告)号:DE3569554D1

    公开(公告)日:1989-05-24

    申请号:DE3569554

    申请日:1985-11-14

    Applicant: STAMICARBON

    Abstract: The invention relates to a thermoplastic moulding compound consisting of:A. at least 95% (wt) of a copolymer consisting of1. 50-95 moles % styrene and/or a-methylstyrene2. 50-5 moles % unsaturated dicarboxylic anhydrideB. at most 5% (wt) of an organic phosphite with the general formula ofwhere r represents hydrogen or th residue of an alkyl, cycloalkyl, aryl, alkaryl or aralkyl, while the R substituents need not to be the same and may contain heteroatoms.It has been found that additions of these phosphites to SMA-containing moulding compounds checks the decomposition of SMA, prevents the moulding compound from setting stuck to the processing equipment and consequently reduces corrosion to a high degree.

    POLYAMIDE COMPOSITION
    6.
    发明专利

    公开(公告)号:CA2022686A1

    公开(公告)日:1991-02-06

    申请号:CA2022686

    申请日:1990-08-03

    Applicant: STAMICARBON

    Abstract: (13) AE 6038 The invention relates to a polyamide composition comprising tetramethylene adipamide, tetramethyleneterephthalamide and tetramethylene isophthalamide units. The polyamide composition has a melting temperature in the same order as the homopolymer tetramethylene adipamide, a comparable crystallinity but very improved melt stability and stiffness.

Patent Agency Ranking