公开(公告)号：EP0175461B1

公开(公告)日：1989-03-08

申请号：EP85305308.0

申请日：1985-07-25

Applicant: STANDEX INTERNATIONAL CORPORATION

Inventor： Hill, John

IPC: H01F15/10 ,  H01F5/04

CPC classification number: H01F27/29 ,  H01F5/04 ,  H01F2005/046 ,  H05K3/308

公开(公告)号：EP0175461A1

公开(公告)日：1986-03-26

申请号：EP85305308.0

申请日：1985-07-25

Applicant: STANDEX INTERNATIONAL CORPORATION

Inventor： Hill, John

IPC: H01F15/10 ,  H01F5/04

CPC classification number: H01F27/29 ,  H01F5/04 ,  H01F2005/046 ,  H05K3/308

Abstract: A coil assembly (31) having a core (32) and a winding (33) on the core (32), wherein a contact element (37, 38) electrically connected to the winding (33) is both mechanically clamped and bonded to the core (32). In an exemplary microcoil assembly (31) having a C-core (32), a generally U-shaped contact element (37, 38) is bonded to each foot (34) of the core by epoxy and mechanically clamped to the core foot (34) to hold the contact element in position while the epoxy cures. One end of the coil winding is soldered to one of the contact elements and the other end of the winding is soldered to the other contact element. The coil assembly (31) is subsequently soldered onto a printed circuit board. Each contact element (37, 38) may include a pin portion (51) to be inserted into a printed circuit board.