公开(公告)号：EP0134606A3

公开(公告)日：1985-11-27

申请号：EP84201140

申请日：1984-08-02

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Aurichio, Joseph Anthony

IPC: H01L21/68

CPC classification number: H01L21/6836 ,  B28D5/0052 ,  H01L21/302 ,  H01L21/3043 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01079

Abstract: A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer ter bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive.

公开(公告)号：EP0182079A3

公开(公告)日：1987-09-30

申请号：EP85112944

申请日：1985-10-11

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Aurichio, Joseph Anthony ,  Goswami, Jagadish Chandra ,  Zingaro, Joseph Robert

IPC: C09J03/16 ,  C08L79/00 ,  C08L63/00

CPC classification number: C09J179/00 ,  C08F283/00 ,  C08L79/08 ,  C09J163/00

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.