Electronic interference shielding laminate
    1.
    发明公开
    Electronic interference shielding laminate 失效
    电子干扰屏蔽层压板

    公开(公告)号:EP0119780A3

    公开(公告)日:1985-10-16

    申请号:EP84301442

    申请日:1984-03-05

    Abstract: Electronic interference shielding of electronic apparatus to a substantial degree is accomplished by using, as the shielding element, a delamination resistant and formable polymer/metal foil laminate. It comprises a flame retardant and relatively rigid, yet formable polymer film, an adhesive layer attached to the polymer film, and a metal foil, of less thickness than the thickness of the polymer film, attached to the side of the adhesive layer remote from the side attached from the polymer film.

    Abstract translation: 电子设备的电子干扰屏蔽在很大程度上是通过使用防分层和可成形的聚合物/金属箔层压板作为屏蔽元件来实现的。 它包括阻燃且相对刚性但可成形的聚合物膜,附着到聚合物膜上的粘合剂层和厚度小于聚合物膜厚度的金属箔,该金属箔附着在粘合剂层的远离 侧从聚合物膜附着。

    Electronic interference shielding laminate
    2.
    发明公开
    Electronic interference shielding laminate 失效
    电子干扰屏蔽层压板

    公开(公告)号:EP0119780A2

    公开(公告)日:1984-09-26

    申请号:EP84301442.4

    申请日:1984-03-05

    Abstract: Electronic interference shielding of electronic apparatus to a substantial degree is accomplished by using, as the shielding element, a delamination resistant and formable polymer/metal foil laminate. It comprises a flame retardant and relatively rigid, yet formable polymer film, an adhesive layer attached to the polymer film, and a metal foil, of less thickness than the thickness of the polymer film, attached to the side of the adhesive layer remote from the side attached from the polymer film.

    Abstract translation: 电子设备的电子干扰屏蔽在很大程度上通过使用抗分层和可成形的聚合物/金属箔层压板作为屏蔽元件来实现。 它包含阻燃且相对刚性但可成型的聚合物膜,附着到聚合物膜上的粘合剂层和厚度小于聚合物膜厚度的金属箔,附着到粘合剂层的远离 侧面与聚合物膜连接。

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