公开(公告)号：EP0114733A2

公开(公告)日：1984-08-01

申请号：EP84300205.6

申请日：1984-01-13

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Herscovici, Eva Jocheved ,  Kim, Ki-Soo

IPC: C08L63/00 ,  C09J3/14 ,  C08F283/10 ,  C08G59/16

CPC classification number: C08F283/10 ,  C08F220/12

Abstract: Reaction mixtures for forming curable epoxy resin compositions comprise an epoxy resin, a monoethylenically unsaturated monomer capable of forming polyacrylate rubber, a chain transfer agent to allow for higher levels of rubber in the curable epoxy resin without undesired vixcosity increase and/or gellation, and a monomer soluble initiator. Optional ingredients include a crosslinking agent for the rubber-forming monomer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin compositions containing polyacrylate rubber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heating, when such curing agent is present, yields cured adhesive compositions.

公开(公告)号：EP0078527A1

公开(公告)日：1983-05-11

申请号：EP82110037.7

申请日：1982-10-29

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Kim, Ki-Soo

IPC: C08F283/10 ,  C09J3/14

CPC classification number: C08F283/10 ,  C09J4/06 ,  C08F220/10 ,  C08F283/00

Abstract: Reaction mixtures for forming curable epoxy resin compositions comprise a major amount of epoxy resin, a minor amount of monoethylenically unsaturated monomer capable of forming polyacrylate rubber, and a monomer soluble initiator. Optional ingredients include a crosslinking agent for the rubber-forming monomer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin compositions containing polyacrylate rubber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heating, yields cured adhesive compositions.

Abstract translation: 用于形成可固化环氧树脂组合物的反应混合物包含主要量的环氧树脂，少量能形成聚丙烯酸酯橡胶的单烯属不饱和单体和单体可溶性引发剂。 任选成分包括用于橡胶形成单体的交联剂，用于橡胶和环氧树脂的接枝剂和环氧固化剂，优选具有当引发剂活化时不满足的活化条件。 加热反应混合物得到含有聚丙烯酸酯橡胶的环氧树脂组合物，后者任选地交联和/或接枝到环氧树脂上。 固化剂的活化，例如通过加热，得到固化的粘合剂组合物。

公开(公告)号：EP0114733A3

公开(公告)日：1985-07-31

申请号：EP84300205

申请日：1984-01-13

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Herscovici, Eva Jocheved ,  Kim, Ki-Soo

IPC: C08L63/00 ,  C09J03/14 ,  C08F283/10 ,  C08G59/16

CPC classification number: C08F283/10 ,  C08F220/12

Abstract: Reaction mixtures for forming curable epoxy resin compositions comprise an epoxy resin, a monoethylenically unsaturated monomer capable of forming polyacrylate rubber, a chain transfer agent to allow for higher levels of rubber in the curable epoxy resin without undesired vixcosity increase and/or gellation, and a monomer soluble initiator. Optional ingredients include a crosslinking agent for the rubber-forming monomer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin compositions containing polyacrylate rubber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heating, when such curing agent is present, yields cured adhesive compositions.

公开(公告)号：EP0171157A3

公开(公告)日：1987-09-30

申请号：EP85304482

申请日：1985-06-24

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： DiSalvo, Anthony Leonard ,  Kim, Ki-Soo

IPC: C08J03/16 ,  H01B01/20

CPC classification number: H01B1/24 ,  C08G59/145 ,  C08L79/08 ,  C09J163/00 ,  H01B1/20 ,  H01B1/22 ,  H05K3/321 ,  H05K3/386

Abstract: Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). Conductive adhesives of this type can be formed by blending the composition with a conductive filler component.