公开(公告)号：EP0711108B1

公开(公告)日：1998-03-04

申请号：EP93918919.7

申请日：1993-08-26

Applicant: STEAG MicroTech GmbH

Inventor： MÜHLFRIEDEL, Eberhard ,  KALLIS, Martin ,  APPICH, Karl

IPC: A01B1/00 ,  B05C11/08 ,  B05C9/12 ,  H01L21/00

Abstract: The invention concerns a device for coating substrates (20). The coating material is first applied to the substrate (20) by means of a capillary slit (21), and in a subsequent centrifuging operation the film is made uniform and reduced in thickness.

公开(公告)号：EP0701487B1

公开(公告)日：1998-11-25

申请号：EP93918918.9

申请日：1993-08-26

Applicant: STEAG MicroTech GmbH

Inventor： MÜHLFRIEDEL, Eberhard ,  KÜBELBECK, Armin ,  GERISCH, Torsten ,  APPICH, Karl ,  SZEKERESCH, Jakob ,  KALLIS, Martin

IPC: B05C9/02 ,  B05C11/105 ,  C23C2/00 ,  H01L21/00 ,  B05D1/26

CPC classification number: H01L21/6715 ,  B05C5/0254 ,  B05C9/02 ,  B05C9/12 ,  B05C11/105 ,  B05D1/26 ,  C23C2/006

Abstract: In a device for lacquering or coating plates (17) or panels through a capillary slot (24) filled with a liquid coating medium, the plate (17) is conveyed with the surface to be lacquered turned downwards, so that a thin layer deposits by capillarity on the plate (17).