公开(公告)号：US20160185593A1

公开(公告)日：2016-06-30

申请号：US14860157

申请日：2015-09-21

Applicant: STMICROELECTRONICS (MALTA) LTD

Inventor： Conrad CACHIA ,  David Oscar VELLA ,  Damian AGIUS ,  Maria SPITERI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2207/098 ,  B81C1/00301 ,  B81C2203/0154 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.

Abstract translation: 具有晶片级封装的MEMS器件提供有：第一管芯和第二管芯的堆叠，其限定至少一个封装内部的第一内表面，并且至少承载一个电接触焊盘，以及至少第一管 外部表面，并且限定包装的第一外表面; 以及模具化合物，至少部分地涂覆第一和第二模具的堆叠并且具有限定与第一外表面相对的包装的第二外表面的至少一部分的前表面。 所述MEMS器件进一步具有：从所述接触焊盘在所述第一内表面向模具化合物的前表面延伸的至少垂直连接结构; 以及至少一个外部连接元件，其在垂直连接结构处电耦合并暴露于封装的外部。

公开(公告)号：US20180044170A1

公开(公告)日：2018-02-15

申请号：US15725190

申请日：2017-10-04

Applicant: STMICROELECTRONICS (MALTA) LTD

Inventor： Conrad CACHIA ,  David Oscar VELLA ,  Damian AGIUS ,  Maria SPITERI

IPC: B81B7/00 ,  H01L23/00 ,  B81C1/00 ,  H01L23/31

CPC classification number: B81B7/007 ,  B81B2207/098 ,  B81C1/00301 ,  B81C2203/0154 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/92124 ,  H01L2224/92164 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85

Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.