公开(公告)号：US12230602B2

公开(公告)日：2025-02-18

申请号：US17811560

申请日：2022-07-08

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Ludovic Fallourd ,  Christophe Serre

IPC: H01L23/00 ,  H01L21/78

Abstract: A method for manufacturing electronic chips includes depositing, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, a protective resin. The method includes forming, in the protective resin, at least one cavity per integrated circuit, in contact with an upper face of the integrated circuit. Metal connection pillars are formed by filling the cavities with metal. The integrated circuits are separated into individual chips by cutting the protective resin along cut lines extending between the metal connection pillars.