公开(公告)号：US20230230906A1

公开(公告)日：2023-07-20

申请号：US18154638

申请日：2023-01-13

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Nicolas MODE ,  Ludovic FALLOURD ,  Laurent BARREAU

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/49838 ,  H01L23/293 ,  H01L23/3135 ,  H01L21/486 ,  H01L21/565

Abstract: The present disclosure concerns a method of manufacturing an electronic component and the obtained component, comprising a substrate, comprising the successive steps of: depositing a first layer of a first resin activated by abrasion to become electrically conductive, on a first surface of said substrate comprising at least one electric contact and, at least partially, on the lateral flanks of said substrate; partially abrading said first layer on the flanks of said substrate.