公开(公告)号：US10796918B2

公开(公告)日：2020-10-06

申请号：US15640203

申请日：2017-06-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandra Alberti ,  Paolo Badala' ,  Antonello Santangelo

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/285 ,  H01L23/482 ,  H01L23/00

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.

公开(公告)号：US09728412B2

公开(公告)日：2017-08-08

申请号：US14970637

申请日：2015-12-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandra Alberti ,  Paolo Badala′ ,  Antonello Santangelo

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/285 ,  H01L23/482 ,  H01L23/00

CPC classification number: H01L21/28518 ,  H01L21/28568 ,  H01L23/4827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/01014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/03

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.