公开(公告)号：EP1860062A3

公开(公告)日：2012-02-22

申请号：EP07252093.5

申请日：2007-05-22

Applicant: STMicroelectronics, Inc.

Inventor： Bryant, Frank ,  Robinson, Murray

IPC: B81C1/00

CPC classification number: B81C1/00119 ,  B81B2203/0315 ,  B81C2201/0109

Abstract: A microfabricated structure and method of making that includes forming a first layer of material on a substrate, forming patterned sacrificial material having a predetermined shape on the first layer of material, and forming a second layer of material over the first layer and the patterned sacrificial material, which is then removed to form an encapsulated cavity. Ideally, the first and second layers are formed of the same type material. A structural support layer can be added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.

公开(公告)号：EP1860062A2

公开(公告)日：2007-11-28

申请号：EP07252093.5

申请日：2007-05-22

Applicant: STMicroelectronics, Inc.

Inventor： Bryant, Frank ,  Robinson, Murray

IPC: B81C1/00

CPC classification number: B81C1/00119 ,  B81B2203/0315 ,  B81C2201/0109

Abstract: A microfabricated structure and method of making that includes forming a first layer of material on a substrate, forming patterned sacrificial material having a predetermined shape on the first layer of material, and forming a second layer of material over the first layer and the patterned sacrificial material, which is then removed to form an encapsulated cavity. Ideally, the first and second layers are formed of the same type material. A structural support layer can be added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.

Abstract translation: 微制造结构及其制造方法包括在基板上形成第一层材料，在第一层材料上形成具有预定形状的图案化牺牲材料，以及在第一层上形成第二层材料，并将图案化的牺牲材料 ，然后将其除去以形成封装腔体。 理想地，第一层和第二层由相同类型的材料形成。 结构支撑层可以添加到第二层。 可以在空腔中形成开口，并且空腔可以并排层叠，通过开口垂直地堆叠有互连，并且两者的组合可以用于构造整个具有互连的堆叠阵列。