公开(公告)号：EP2709145A3

公开(公告)日：2016-05-11

申请号：EP13182996.2

申请日：2013-09-04

Applicant: STMicroelectronics, Inc.

Inventor： Zhang, John H

IPC: H01L21/66 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12

CPC classification number: H01L22/12 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for performing metrology of a wafer. The apparatus may include a substrate with a plurality of microprobes (520). A plurality of light sources may direct light onto each of the microprobes (520). Light reflected from the microprobes may be detected by a plurality of photodetectors thereby generating a detection signal associated with each of the microprobes. A controller (610)may send a driving signal to each of the plurality of microprobes and determine a height profile and a surface charge profile of the wafer based on each of the detection signals.

公开(公告)号：EP2712703A2

公开(公告)日：2014-04-02

申请号：EP13182997.0

申请日：2013-09-04

Applicant: STMicroelectronics, Inc.

Inventor： Zhang, John H

IPC: B24B37/005 ,  B24B49/04 ,  B24B49/10 ,  B24B7/22

CPC classification number: B24B7/228 ,  B24B37/005 ,  B24B49/04 ,  B24B49/105

Abstract: A semiconductor processing device and a method of operating the same. The method may include measuring at least one property of a semiconductor wafer and determining a recipe for processing the semiconductor wafer based on the at least one property. The semiconductor wafer may be processed with a plurality of chemical mechanical polishing (CMP) modules based on the determined recipe, wherein the recipe comprises a value of at least one parameter for use by each of the plurality of CMP modules. The measurements may be made in situ or by an inline metrology device. The recipe and various parameters associated with the recipe may be determined by a controller of the semiconductor processing device.

Abstract translation: 一种半导体处理装置及其操作方法。 该方法可以包括测量半导体晶片的至少一个性质并且基于至少一个属性确定用于处理半导体晶片的配方。 可以基于所确定的配方，利用多个化学机械抛光（CMP）模块来处理半导体晶片，其中该配方包括用于多个CMP模块中的每一个的至少一个参数的值。 测量可以在原位或通过在线测量装置进行。 配方和与配方相关的各种参数可以由半导体处理装置的控制器确定。

公开(公告)号：EP2709146A2

公开(公告)日：2014-03-19

申请号：EP13182994.7

申请日：2013-09-04

Applicant: STMicroelectronics, Inc.

Inventor： Zhang, John H

IPC: H01L21/67

CPC classification number: H01L21/67219 ,  H01L21/67167 ,  H01L21/67184

Abstract: An integrated tool to reduce defects in manufacturing a semiconductor device by reducing queue times during a manufacturing process. The integrated tool may include at least one a polishing tool comprising at least one polishing module and at once deposition tool comprising at once deposition chamber. At least one pump-down chamber may connect the polishing tool to the deposition tool. The at once pump-down chamber includes a through which the semiconductor device is passed. Defects in the semiconductor device are reduced by reducing the queue time at various stages of the fabrication process.

Abstract translation: 一种集成的工具，通过减少制造过程中的队列时间来减少制造半导体器件的缺陷。 该集成工具可以包括至少一个抛光工具，其包括至少一个抛光模块，并且一次沉积工具包括一次沉积室。 至少一个抽水室可以将抛光工具连接到沉积工具。 一次抽空室包括半导体器件通过的通孔。 通过在制造过程的各个阶段减少队列时间来减少半导体器件中的缺陷。

公开(公告)号：EP2709145A2

公开(公告)日：2014-03-19

申请号：EP13182996.2

申请日：2013-09-04

Applicant: STMicroelectronics, Inc.

Inventor： Zhang, John H

IPC: H01L21/66

CPC classification number: H01L22/12 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for performing metrology of a wafer. The apparatus may include a substrate with a plurality of microprobes (520). A plurality of light sources may direct light onto each of the microprobes (520). Light reflected from the microprobes may be detected by a plurality of photodetectors thereby generating a detection signal associated with each of the microprobes. A controller (610)may send a driving signal to each of the plurality of microprobes and determine a height profile and a surface charge profile of the wafer based on each of the detection signals.

Abstract translation: 用于晶片的进行计量的装置。 该装置可以包括与微探针（520）的多个A衬底。 的光源的多个可以引导光到每个微探针（520）的。 从微探针反射的光可以由光电检测器从而生成与每个所述微探针相关联的检测信号的多元检测。 控制器（610）可以发送一个驱动信号给每个微探针和确定性矿的高度轮廓以及基于各检测信号的所述晶片的表面电荷分布的多个。

公开(公告)号：EP2713390A2

公开(公告)日：2014-04-02

申请号：EP13184857.4

申请日：2013-09-17

Applicant: STMicroelectronics, Inc. ,  International Business Machines Corporation

Inventor： Zhang, John H ,  Clevenger, Lawrence A ,  Radens, Carl ,  Xu, Yiheng

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L21/76834 ,  H01L21/76831 ,  H01L23/5226 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of metal tracks (48a, 48b, 48c) are formed in a plurality of intermetal dielectric layers (38) stacked in an integrated circuit die. Thin protective dielectric layers (52a, 52b) are formed around the metal tracks. The protective dielectric layers act as a hard mask to define contact vias (64a, 64b, 64c) between metal tracks in the intermetal dielectric layers.

Abstract translation: 的金属轨道（48A，48B，48C）形成有多个在堆叠到集成电路的金属间介电层（38）的复数。 薄的保护介电层（52A，52B）围绕的金属轨道形成。 保护性电介质层充当硬掩模，以限定在所述金属间介电层的金属轨道之间的接触通孔（64A，64B，64C）。

公开(公告)号：EP2713389A2

公开(公告)日：2014-04-02

申请号：EP13184856.6

申请日：2013-09-17

Applicant: STMicroelectronics, Inc. ,  International Business Machines Corporation

Inventor： Zhang, John H ,  Clevenger, Lawrence A ,  Radens, Carl ,  Xu, Yiheng

IPC: H01L21/768

CPC classification number: H01L21/76816 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/76838 ,  H01L21/76897 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53295

Abstract: A plurality of metal tracks (32,50,66) are formed in an integrated circuit die (20) in three metal layers stacked within the die. A protective dielectric layer (42,52) is formed around metal tracks of an intermediate metal layer (50). The protective dielectric layer acts as a hard mask to define contact vias (49) between metal tracks in the metal layers above and below the intermediate metal layer.

Abstract translation: 多个金属轨道（32,50,66）形成在堆叠在管芯内的三个金属层的集成电路管芯（20）中。 在中间金属层（50）的金属轨道周围形成有保护电介质层（42,52）。 保护性介电层用作硬掩模，以在中间金属层上方和下方的金属层中的金属轨道之间限定接触通孔（49）。