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    Microfluidic system with single drive signal for multiple nozzles
    9.
    发明授权
    Microfluidic system with single drive signal for multiple nozzles 有权
    具有多个喷嘴的单驱动信号的微流体系统

    公开(公告)号：US09358567B2

    公开(公告)日：2016-06-07

    申请号：US14310886

    申请日：2014-06-20

    Applicant: STMicroelectronics, Inc.

    Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

    IPC: B05B17/06 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

    CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

    Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。

    MICROFLUIDIC DELIVERY SYSTEM WITH A DIE ON A RIGID SUBSTRATE
    10.
    发明申请
    MICROFLUIDIC DELIVERY SYSTEM WITH A DIE ON A RIGID SUBSTRATE 审中-公开
    具有在刚性基板上的模具的微流体输送系统

    公开(公告)号：US20150373840A1

    公开(公告)日：2015-12-24

    申请号：US14310601

    申请日：2014-06-20

    Applicant: STMicroelectronics, Inc.

    Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

    IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

    CPC classification number: H05K1/0272 ,  B41J2/17506 ,  B41J2/17513 ,  B41J2/1753 ,  H05K1/0212 ,  Y10T137/6416

    Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

    Abstract translation: 本公开涉及一种被配置为垂直远离热微流体模头喷射流体以与香味油或其它流体一起使用的系统。 模具耦合到将模具与流体的容器分离的刚性平面支撑板。 支撑板包括一个内衬有惰性衬垫的开口，该衬垫保护支撑板的内表面免受流体的影响。 支撑板包括与外部电源的接触并且在第一表面上与模具接触。 模具耦合到该第一表面，使得第二表面保持没有电连接。

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