公开(公告)号：EP1235471A1

公开(公告)日：2002-08-28

申请号：EP01301786.8

申请日：2001-02-27

Applicant: STMicroelectronics, Ltd.

Inventor： Evans, Paul

IPC: H05K1/14

CPC classification number: H01R12/523 ,  H05K1/144

Abstract: A stackable module for a processor system is described. The module comprises a support plate with a set of topside circuit components mounted to its topside, and topside and underside connectors. The module can be stacked with other such modules and are provided with conductive tracks which are arranged to convey transport stream data and transport stream control signals between modules in a stack. The invention also provides a stack of such modules in a processor system.

Abstract translation: 描述了用于处理器系统的可堆叠模块。 模块包括具有安装到其顶侧的一组顶侧电路部件的支撑板以及顶侧和下侧连接器。 该模块可以与其它这样的模块堆叠并且设置有导电轨道，其被布置成在堆叠中的模块之间传送传输流数据和传输流控制信号。 本发明还在处理器系统中提供这样的模块的堆叠。