公开(公告)号：US20190172795A1

公开(公告)日：2019-06-06

申请号：US16210149

申请日：2018-12-05

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Eric SABOURET ,  Krysten ROCHEREAU ,  Olivier HINSINGER ,  Flore PERSIN-CRELEROT

IPC: H01L23/00 ,  H05K3/34 ,  H01L21/66 ,  H01L23/498

Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.

公开(公告)号：US20220165797A1

公开(公告)日：2022-05-26

申请号：US17531309

申请日：2021-11-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jonathan STECKEL ,  Krysten ROCHEREAU

IPC: H01L27/28 ,  H01L51/42 ,  H01L51/50

Abstract: An optoelectronic device includes a substrate with a light emitter and a photodetector supported by the substrate. The light emitter and photodetector are stacked one on top of the other. At least one of the light emitter and photodetector is formed by a stack including the following order of layers: a first electrode layer, a hole transport layer, a quantum nano-structure layer (for example, a semiconductor nanoparticle layer, a quantum dot layer, a quantum rod layer or quantum well layer), an electron transport layer and a second electrode layer. An insulating layer is positioned between the light emitter and photodetector in the stack.

公开(公告)号：US20210272915A1

公开(公告)日：2021-09-02

申请号：US17325999

申请日：2021-05-20

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Eric SABOURET ,  Krysten ROCHEREAU ,  Olivier HINSINGER ,  Flore PERSIN-CRELEROT

IPC: H01L23/00 ,  H05K3/34 ,  H01L23/498 ,  H01L21/66

Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.