公开(公告)号：EP2075915A1

公开(公告)日：2009-07-01

申请号：EP07150488.0

申请日：2007-12-29

Applicant: STMicroelectronics Design and Application S.R.O.

Inventor： Vacula, Patrik ,  Vacula, Milos ,  Lzicar, Milan

IPC: H03K19/177 ,  H03K19/173

CPC classification number: H03K19/17736 ,  H03K19/1735 ,  H03K19/17796

Abstract: Integrated mask-programmable device, having a plurality of metal levels including a top metal level, a bottom metal level and a first intermediate metal level formed between the top and bottom metal levels, and a plurality of via levels arranged between the bottom and the first intermediate metal levels and between the first intermediate and the top metal levels and connecting each metal level to adjacent metal levels. The plurality of metal levels forms a first, a second and at least a third terminal, the top and bottom metal levels having at least two metal regions, and the first intermediate metal level having at least three metal regions. The first terminal is connected to third terminal or the second terminal is connected to the third terminal by modifying a single metal or via level.

Abstract translation: 集成掩模可编程装置，具有多个金属层，包括形成在顶部和底部金属层之间的顶部金属层，底部金属层和第一中间金属层，以及布置在底部和底部金属层之间的多个通孔层 中间金属水平和第一中间和顶部金属水平之间并且将每个金属水平连接到相邻的金属水平。 多个金属层形成第一，第二和至少第三末端，顶部和底部金属层具有至少两个金属区域，并且第一中间金属层具有至少三个金属区域。 第一端子连接到第三端子，或者通过修改单个金属或通孔电平将第二端子连接到第三端子。