公开(公告)号：US20250125232A1

公开(公告)日：2025-04-17

申请号：US18910748

申请日：2024-10-09

Applicant: STMicroelectronics International N.V.

Inventor： Brunella CAFRA ,  Antonio LANDI ,  Agata GRASSO ,  Crocifisso Marco Antonio RENNA

IPC: H01L23/495

Abstract: Wettable metalization multilayer formed by an adhesion layer, containing titanium; a barrier layer, containing nickel; and a sintering layer, containing silver. A portion of the sintering layer, facing the barrier layer, contains atoms of a metal material chosen between aluminum and tin. A portion of the barrier layer facing the sintering layer may contain atoms of the metal material. The sintering layer is obtained depositing by PVD and spinning a metal material layer and then a silver layer, causing the diffusion of the atoms of the metal material in the silver layer.