公开(公告)号：EP1420458A2

公开(公告)日：2004-05-19

申请号：EP03026134.1

申请日：2003-11-13

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loo, Kum-Weng ,  Kho, Chek-Lim

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  G01L9/00

CPC classification number: B81C1/00269 ,  G01L19/143 ,  H01L23/04 ,  H01L23/3135 ,  H01L23/473 ,  H01L24/97 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package is disclosed. The package includes a substrate; a semiconductor die attached to the substrate; a housing part attached to the substrate and arranged to surround the semiconductor die; and solidified moulding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.

Abstract translation: 公开了半导体封装。 所述包装包括基材; 附着在基板上的半导体管芯; 壳体部分，其附接到所述基板并且布置成围绕所述半导体管芯; 以及固化的模制材料，其布置在壳体周围并且粘附到基板上以将壳体固定在基板上的适当位置。 还公开了制造封装的方法。

公开(公告)号：EP1420458A3

公开(公告)日：2005-05-04

申请号：EP03026134.1

申请日：2003-11-13

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loo, Kum-Weng ,  Kho, Chek-Lim

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  G01L9/00

CPC classification number: B81C1/00269 ,  G01L19/143 ,  H01L23/04 ,  H01L23/3135 ,  H01L23/473 ,  H01L24/97 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package is disclosed. The package includes a substrate; a semiconductor die attached to the substrate; a housing part attached to the substrate and arranged to surround the semiconductor die; and solidified moulding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.