Abstract:
A diode (100; 200) is proposed. The diode is integrated on a chip (105) of semiconductor material having an anode surface (105a) and a cathode surface (105c) opposite to each other. The diode comprises at least one cathode region (120) having a doping of a first type, the cathode region extending from the cathode surface in the chip. Furthermore, the diode comprises an intrinsic region (130) having a doping of the first type with a dopant concentration lower than a dopant concentration of the cathode region, the intrinsic region extending between the anode surface and the cathode region. In addition, the diode comprises a plurality of anode regions (135c, 135f) having a doping of a second type, each anode region extending from the anode surface in the intrinsic region. The diode further comprises a cathode electrode (110) of electrically conductive material electrically coupled with said at least one cathode region on the cathode surface, and an anode electrode (115) of electrically conducting material. In the solution according to an embodiment of the present disclosure, one or more contacted anode regions (135c) of said anode regions are electrically coupled with the anode electrode on the anode surface, and one or more floating anode regions (135f) of said anode regions are electrically insulated from the anode electrode. The diode is configured so that charge carriers are injected from said at least one floating anode region into the intrinsic region in response to the applying of a control voltage between the anode electrode and the cathode electrode exceeding a threshold voltage of the diode.
Abstract:
A diode (100; 200) is proposed. The diode is integrated on a chip (105) of semiconductor material having an anode surface (105a) and a cathode surface (105c) opposite to each other. The diode comprises at least one cathode region (120) having a doping of a first type, the cathode region extending from the cathode surface in the chip. Furthermore, the diode comprises an intrinsic region (130) having a doping of the first type with a dopant concentration lower than a dopant concentration of the cathode region, the intrinsic region extending between the anode surface and the cathode region. In addition, the diode comprises a plurality of anode regions (135c, 135f) having a doping of a second type, each anode region extending from the anode surface in the intrinsic region. The diode further comprises a cathode electrode (110) of electrically conductive material electrically coupled with said at least one cathode region on the cathode surface, and an anode electrode (115) of electrically conducting material. In the solution according to an embodiment of the present disclosure, one or more contacted anode regions (135c) of said anode regions are electrically coupled with the anode electrode on the anode surface, and one or more floating anode regions (135f) of said anode regions are electrically insulated from the anode electrode. The diode is configured so that charge carriers are injected from said at least one floating anode region into the intrinsic region in response to the applying of a control voltage between the anode electrode and the cathode electrode exceeding a threshold voltage of the diode.
Abstract:
A junction device including at least a first type semiconductor region (33) and a a second type semiconductor region a(34), which are arranged contiguous to one another and have a first and, respectively, a second type of conductivity, which are opposite to one another, and a first and a second biasing region (37, 38); the device is moreover provided with a resistive region (35), which has the first type of conductivity and extends from the first type semiconductor region (33) and is contiguous to the second type semiconductor region (34) so as to form a resistive path between the first and the second biasing regions (37, 38).