公开(公告)号：EP3839520A1

公开(公告)日：2021-06-23

申请号：EP20212118.2

申请日：2020-12-07

Applicant: STMicroelectronics S.r.l.

Inventor： DARMANIN, Jean Marie ,  VALZASINA, Carlo ,  TOCCHIO, Alessandro ,  GATTERE, Gabriele

IPC: G01P15/125 ,  B81B3/00 ,  B81B5/00 ,  G01L1/14 ,  G01P15/08

Abstract: A micromechanical device (50) comprising: a semiconductor body (51); a first mobile structure (53; 253); an elastic assembly (57, 59; 259), coupled to the first mobile structure and to the semiconductor body (51) and adapted to undergo deformation in a direction (X) ; and at least one abutment element (66b; 66a). The elastic assembly (57, 59; 259) is configured to enable an oscillation of the first mobile structure (53; 253) as a function of a force applied thereto. The first mobile structure (53; 253), the abutment element (66b; 66a) and the elastic assembly (57, 59; 259) are arranged with respect to one another in such a way that: when said force is lower than a force threshold, the elastic assembly (57, 59; 259) operates with a first elastic constant (K 1 ; K 4 ); and when said force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant (K 1 + K 2 ; K 5 ) different from the first elastic constant.
Main figure: Figure 2

公开(公告)号：EP4321876A1

公开(公告)日：2024-02-14

申请号：EP23185740.0

申请日：2023-07-17

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  DARMANIN, Jean Marie ,  RIZZINI, Francesco

IPC: G01P15/125 ,  G01P21/00 ,  G01P15/08 ,  B81B3/00

Abstract: A microelectromechanical sensor device having a sensing structure (1) with: a substrate (2); an inertial mass (3), suspended above the substrate (2) and elastically coupled to a rotor anchoring structure (6) by elastic coupling elements (8), to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes (9), integrally coupled to the inertial mass (3) to be movable due to the inertial movement; and second sensing electrodes (12), fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes (9) to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes (12) are arranged in a suspended manner above the substrate (2) and a compensation structure (20) is configured to move the second sensing electrodes (12) with respect to the first sensing electrodes (9) and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure (1).

公开(公告)号：EP4123313A1

公开(公告)日：2023-01-25

申请号：EP22183947.5

申请日：2022-07-08

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  DARMANIN, Jean Marie ,  RIZZINI, Francesco ,  VALZASINA, Carlo

IPC: G01P15/08 ,  B81B5/00 ,  G01P15/125 ,  G01P15/13

Abstract: A closed-loop microelectromechanical accelerometer includes a substrate (23) of semiconductor material, an out-of-plane sensing mass (13) and feedback electrodes (17a-17d). The out-of-plane sensing mass (13), of semiconductor material, has a first side (13a) facing the supporting body (11) and a second side (13b) opposite to the first side (13a). The out-of-plane sensing mass (13) is also connected to the supporting body (11) to oscillate around a non-barycentric fulcrum axis (F) parallel to the first side (13a) and to the second side (13b) and perpendicular to an out-of-plane sensing axis (Z). The feedback electrodes (17a-17d) are capacitively coupled to the sensing mass (13) and are configured to apply opposite electrostatic forces (F FB1 , F FB2 ) to the sensing mass (13).