公开(公告)号：EP3689816A1

公开(公告)日：2020-08-05

申请号：EP20153241.3

申请日：2020-01-22

Applicant: STMicroelectronics S.r.l.

Inventor： SEGHIZZI, Luca ,  MONTAGNA, Linda ,  VISALLI, Giuseppe ,  AZPEITIA URQUIA, Mikel

IPC: B81C1/00 ,  G02B26/08

Abstract: A method of manufacturing an integrated component (1), comprising the steps of: arranging a first wafer (100) of semiconductor material, having a surface (2a); arranging a second wafer (200) of semiconductor material, including a substrate (28) and a structural layer (32) on the substrate (28), the structural layer (32) integrating a detector device (26) for detecting electromagnetic radiation (R3); coupling the structural layer (32) of the second wafer (200) to the surface (2a) of the first wafer (100); and processing the substrate (28) of the second wafer (200) to form a stator (95), a rotor (94), and a mobile mass (93) of a micromirror (104), the stator (95) and the rotor (94) forming an assembly for capacitively driving the mobile mass (93).